Sung Kyu Lim

Person

Duluth, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through-silicon via (TSV) crack sensors for detecting TSV cracks in...
- Patent number 9,869,713
- Issue date Jan 16, 2018
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power delivery network (PDN) design for monolithic three-dimensiona...
- Patent number 9,741,691
- Issue date Aug 22, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,626,311
- Issue date Apr 18, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Memory controller placement in a three-dimensional (3D) integrated...
- Patent number 9,569,380
- Issue date Feb 14, 2017
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock tree synthesis for low cost pre-bond testing of 3D integrated...
- Patent number 9,508,615
- Issue date Nov 29, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Intellectual property block design with folded blocks and duplicate...
- Patent number 9,483,598
- Issue date Nov 1, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Clock skew compensation with adaptive body biasing in three-dimensi...
- Patent number 9,256,246
- Issue date Feb 9, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- H03 - BASIC ELECTRONIC CIRCUITRY

Patents Applicationslast 30 patents

Information Patent Application
POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...
- Publication number 20160322331
- Publication date Nov 3, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLOCK TREE DESIGN METHODS FOR ULTRA-WIDE VOLTAGE RANGE CIRCUITS
- Publication number 20160267214
- Publication date Sep 15, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...
- Publication number 20160258996
- Publication date Sep 8, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G01 - MEASURING TESTING
Information Patent Application
INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...
- Publication number 20160232271
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...
- Publication number 20160233134
- Publication date Aug 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...
- Publication number 20160217087
- Publication date Jul 28, 2016
- QUALCOMM Incorporated
- Sung Kyu Lim
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...
- Publication number 20160042110
- Publication date Feb 11, 2016
- QUALCOMM Incorporated
- Sung Kyu LIM
- G06 - COMPUTING CALCULATING COUNTING

Sung Kyu Lim

Person

Patents Grantslast 30 patents

Through-silicon via (TSV) crack sensors for detecting TSV cracks in...

Power delivery network (PDN) design for monolithic three-dimensiona...

Memory controller placement in a three-dimensional (3D) integrated...

Memory controller placement in a three-dimensional (3D) integrated...

Clock tree synthesis for low cost pre-bond testing of 3D integrated...

Intellectual property block design with folded blocks and duplicate...

Clock skew compensation with adaptive body biasing in three-dimensi...

Patents Applicationslast 30 patents

POWER DELIVERY NETWORK (PDN) DESIGN FOR MONOLITHIC THREE-DIMENSIONA...

CLOCK TREE DESIGN METHODS FOR ULTRA-WIDE VOLTAGE RANGE CIRCUITS

THROUGH-SILICON VIA (TSV) CRACK SENSORS FOR DETECTING TSV CRACKS IN...

INTELLECTUAL PROPERTY BLOCK DESIGN WITH FOLDED BLOCKS AND DUPLICATE...

CLOCK TREE SYNTHESIS FOR LOW COST PRE-BOND TESTING OF 3D INTEGRATED...

MEMORY CONTROLLER PLACEMENT IN A THREE-DIMENSIONAL (3D) INTEGRATED...

HIGH QUALITY PHYSICAL DESIGN FOR MONOLITHIC THREE-DIMENSIONAL INTEG...