Sung-Li WANG

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Backside contact structures with stacked metal silicide layers for...
- Patent number 12,148,807
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial backside contact
- Patent number 12,080,766
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistor with multi-metal gate via and method
- Patent number 12,074,061
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sheng-Tsung Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 12,068,252
- Issue date Aug 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capping layer for liner-free conductive structures
- Patent number 12,057,397
- Issue date Aug 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Source/drain feature to contact interfaces
- Patent number 12,051,730
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ding-Kang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for barrier-less plug
- Patent number 12,051,592
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side contact structures in semiconductor devices
- Patent number 12,046,634
- Issue date Jul 23, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 12,040,372
- Issue date Jul 16, 2024
- Tawian Semiconductor Manufacturing Company, Ltd.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures with deposited silicide layers
- Patent number 12,027,372
- Issue date Jul 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Middle-of-line interconnect structure and manufacturing method
- Patent number 12,009,294
- Issue date Jun 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure for semiconductor device
- Patent number 12,002,867
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective dual silicide formation
- Patent number 11,990,376
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having spacer residue
- Patent number 11,984,450
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned barrier for metal vias
- Patent number 11,972,974
- Issue date Apr 30, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,929,327
- Issue date Mar 12, 2024
- Taiwan Semiconductor Manufacturing Co., Inc.
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid conductive structures
- Patent number 11,894,437
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,894,438
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yee-Chia Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field effect transistors with dual silicide contact structures
- Patent number 11,855,177
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Peng-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wrap-around contact on FinFET
- Patent number 11,854,898
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device structure with high contact area
- Patent number 11,855,215
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures with anchor points
- Patent number 11,837,544
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsu-Kai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structure formed by cyclic chemical vapor deposition
- Patent number 11,823,896
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and manufacturing method for the same
- Patent number 11,817,384
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structures in semiconductor devices
- Patent number 11,810,960
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact plugs for semiconductor device
- Patent number 11,756,864
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Mrunal A Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming metal contact for semiconductor device
- Patent number 11,715,763
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Epitaxial backside contact
- Patent number 11,626,494
- Issue date Apr 11, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having cap layer
- Patent number 11,610,888
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liner-free conductive structures
- Patent number 11,594,609
- Issue date Feb 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shuen-Shin Liang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240379758
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Yip LOH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR INSULATING FINS
- Publication number 20240379797
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240379425
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Bo-Yu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE
- Publication number 20240379457
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- SUNG-LI WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD
- Publication number 20240379422
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sheng-Tsung WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES
- Publication number 20240371952
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EPITAXIAL BACKSIDE CONTACT
- Publication number 20240363704
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Capping Layer For Liner-Free Conductive Structures
- Publication number 20240355741
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Conductive Structures
- Publication number 20240355742
- Publication date Oct 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Source/Drain Feature to Contact Interfaces
- Publication number 20240347611
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ding-Kang Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR BARRIER-LESS PLUG
- Publication number 20240347342
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Side Contact Structures in Semiconductor Devices
- Publication number 20240339497
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures In Semiconductor Devices
- Publication number 20240332393
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsu-Kai CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Contact Structures With Deposited Silicide Layers
- Publication number 20240312786
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT
- Publication number 20240313075
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DUAL SILICIDE FORMATION
- Publication number 20240304499
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peng-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD
- Publication number 20240282698
- Publication date Aug 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE
- Publication number 20240274687
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNED BARRIER FOR METAL VIAS
- Publication number 20240243009
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Li WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145569
- Publication date May 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yee-Chia YEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE WITH HIGH CONTACT AREA
- Publication number 20240105848
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- B82 - NANO-TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME
- Publication number 20240096997
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIELD EFFECT TRANSISTORS WITH DUAL SILICIDE CONTACT STRUCTURES
- Publication number 20240088261
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Peng-Wei Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055491
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Hung Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF
- Publication number 20240055485
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038595
- Publication date Feb 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Kan HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Void-Free Conductive Contact Formation
- Publication number 20240021687
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Wei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME
- Publication number 20240021501
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Mrunal A. Khaderbad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE NITRIDE FEATURE AND METHO...
- Publication number 20240006505
- Publication date Jan 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Chin CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...
- Publication number 20230402366
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shuen-Shin LIANG
- H01 - BASIC ELECTRIC ELEMENTS

Sung-Li WANG

Person

Patents Grantslast 30 patents

Backside contact structures with stacked metal silicide layers for...

Epitaxial backside contact

Field effect transistor with multi-metal gate via and method

Hybrid conductive structures

Capping layer for liner-free conductive structures

Source/drain feature to contact interfaces

Method and structure for barrier-less plug

Dual side contact structures in semiconductor devices

Contact structures in semiconductor devices

Contact structures with deposited silicide layers

Middle-of-line interconnect structure and manufacturing method

Contact structure for semiconductor device

Selective dual silicide formation

Semiconductor device having spacer residue

Self-aligned barrier for metal vias

Liner-free conductive structures with anchor points

Hybrid conductive structures

Semiconductor device and manufacturing method thereof

Field effect transistors with dual silicide contact structures

Wrap-around contact on FinFET

Semiconductor device structure with high contact area

Liner-free conductive structures with anchor points

Conductive structure formed by cyclic chemical vapor deposition

Interconnect structure and manufacturing method for the same

Contact structures in semiconductor devices

Contact plugs for semiconductor device

Method of forming metal contact for semiconductor device

Epitaxial backside contact

Semiconductor device having cap layer

Liner-free conductive structures

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

TRANSISTOR INSULATING FINS

CONDUCTIVE FEATURE OF SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

METHOD FOR MANUFACTURING A SEMICONDUCTOR STRUCTURE

FIELD EFFECT TRANSISTOR WITH MULTI-METAL GATE VIA AND METHOD

BACKSIDE CONTACT STRUCTURES FOR SEMICONDUCTOR DEVICES

EPITAXIAL BACKSIDE CONTACT

Capping Layer For Liner-Free Conductive Structures

Hybrid Conductive Structures

Source/Drain Feature to Contact Interfaces

METHOD AND STRUCTURE FOR BARRIER-LESS PLUG

Dual Side Contact Structures in Semiconductor Devices

Contact Structures In Semiconductor Devices

Contact Structures With Deposited Silicide Layers

METHOD AND DEVICE RELATED TO SEAMLESS METAL CONTACT

SELECTIVE DUAL SILICIDE FORMATION

MIDDLE-OF-LINE INTERCONNECT STRUCTURE AND MANUFACTURING METHOD

CONTACT STRUCTURE FOR SEMICONDUCTOR DEVICE

SELF-ALIGNED BARRIER FOR METAL VIAS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE WITH HIGH CONTACT AREA

SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME

FIELD EFFECT TRANSISTORS WITH DUAL SILICIDE CONTACT STRUCTURES

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHODS OF FABRICATION THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Void-Free Conductive Contact Formation

CONTACT PLUGS FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING SAME

SEMICONDUCTOR DEVICE INCLUDING CONDUCTIVE NITRIDE FEATURE AND METHO...

SEMICONDUCTOR DEVICE INCLUDING METAL SURROUNDING VIA CONTACT AND ME...