Sung-Ping Huang

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Diode test module for monitoring leakage current and its method the...
- Patent number 12,248,019
- Issue date Mar 11, 2025
- Amazing Microelectronic Corp.
- Chih-Ting Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 12,242,108
- Issue date Mar 4, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 12,237,288
- Issue date Feb 25, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector pair
- Patent number D1055862
- Issue date Dec 31, 2024
- Molex, LLC
- Thomas R. Marrapode
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Laminar gas flow filter
- Patent number 12,172,117
- Issue date Dec 24, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jyh-Shiou Hsu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Semiconductor device
- Patent number 12,165,990
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 12,165,992
- Issue date Dec 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,148,678
- Issue date Nov 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector housing
- Patent number D1047916
- Issue date Oct 22, 2024
- Molex, LLC
- Thomas R. Marrapode
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Photonic silicon spatial beam transformer integrated on 3DIC packag...
- Patent number 12,124,078
- Issue date Oct 22, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- G02 - OPTICS
Information Patent Grant
Packages with multiple types of underfill and method forming the same
- Patent number 12,087,733
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Joint structure in semiconductor package and manufacturing method t...
- Patent number 12,087,727
- Issue date Sep 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector
- Patent number D1040765
- Issue date Sep 3, 2024
- Molex, LLC
- Thomas R. Marrapode
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 12,080,681
- Issue date Sep 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic chip coupler connector module
- Patent number 12,068,791
- Issue date Aug 20, 2024
- Molex, LLC
- Thomas R. Marrapode
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 12,051,668
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for humidity control of FOUP during semiconduct...
- Patent number 12,051,609
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector
- Patent number D1036388
- Issue date Jul 23, 2024
- Molex, LLC
- Thomas R. Marrapode
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Chip package structure
- Patent number 12,033,969
- Issue date Jul 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of forming same
- Patent number 12,015,023
- Issue date Jun 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating semiconductor structure
- Patent number 12,002,721
- Issue date Jun 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor die package and method of manufacture
- Patent number 11,990,443
- Issue date May 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material having different thicknesses in packages
- Patent number 11,916,023
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photonic semiconductor device and method of manufacture
- Patent number 11,852,868
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,764,123
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and fabricating method thereof
- Patent number 11,705,407
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of forming the same
- Patent number 11,699,674
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, integrated optical communication system
- Patent number 11,694,939
- Issue date Jul 4, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device
- Patent number 11,690,198
- Issue date Jun 27, 2023
- ASUSTeK COMPUTER Inc.
- Yi-Chi Lai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical waveguide connection assembly and optical module comprising...
- Patent number 11,656,416
- Issue date May 23, 2023
- Molex, LLC
- Sung-Ping Huang
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
Laminar Gas Flow Filter
- Publication number 20250065254
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jyh-Shiou Hsu
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20250062250
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing company Ltd.
- KUAN-YU HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20250062249
- Publication date Feb 20, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-PAPER DISPLAY PANEL
- Publication number 20250053039
- Publication date Feb 13, 2025
- E Ink Holdings Inc.
- Chia-Ming Hsieh
- G02 - OPTICS
Information Patent Application
PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...
- Publication number 20240418932
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu HUANG
- G02 - OPTICS
Information Patent Application
BIPOLAR JUNCTION TRANSISTOR WITH LATERAL AND VERTICAL CONDUCTING PATHS
- Publication number 20240421146
- Publication date Dec 19, 2024
- Amazing Microelectronic Corp.
- Sung-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240387311
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF
- Publication number 20240385398
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION
- Publication number 20240384414
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PHOTONIC CHIP COUPLER CONNECTOR MODULE
- Publication number 20240372631
- Publication date Nov 7, 2024
- Molex, LLC
- Thomas R. MARRAPODE
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
METHOD OF FABRICATING PACKAGE STRUCTURE
- Publication number 20240363587
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...
- Publication number 20240347363
- Publication date Oct 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...
- Publication number 20240339432
- Publication date Oct 10, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOP FORMING MEMORY DEVICE
- Publication number 20240334672
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jenn-Gwo HWU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME
- Publication number 20240297166
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ATRIAL HIGH RATE EPISODE PREDICTION MODEL TRAINING METHOD AND APPAR...
- Publication number 20240242094
- Publication date Jul 18, 2024
- National Yang Ming Chiao Tung University
- Shin-Mu TSENG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TRANSIENT VOLTAGE SUPPRESSOR WITH ADJUSTABLE TRIGGER AND HOLDING VO...
- Publication number 20240186315
- Publication date Jun 6, 2024
- Amazing Microelectronic Corp.
- Sung-Chih HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES
- Publication number 20240162166
- Publication date May 16, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20240103220
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE AND METHODS FOR FORMING THE SAME
- Publication number 20240099030
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20240096719
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXHAUST MANIFOLD FOR SEMICONDUCTOR PROCESS CHAMBER
- Publication number 20240030045
- Publication date Jan 25, 2024
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Sung-Ju Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME
- Publication number 20230395564
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20230387058
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230378132
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Wei Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optical Transceiver and Manufacturing Method Thereof
- Publication number 20230350142
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF
- Publication number 20230307382
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20230299033
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuan-Yu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION
- Publication number 20230257882
- Publication date Aug 17, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY
- Yung-Tsun Liu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEFLECTOR FOR CHAMBER CLEANING
- Publication number 20230257875
- Publication date Aug 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuang-Wei Cheng
- B08 - CLEANING

Sung-Ping Huang

Person

Patents Grantslast 30 patents

Diode test module for monitoring leakage current and its method the...

Photonic semiconductor device and method of manufacture

Semiconductor die package and method of manufacture

Connector pair

Laminar gas flow filter

Semiconductor device

Package structure and fabricating method thereof

Semiconductor package and manufacturing method thereof

Connector housing

Photonic silicon spatial beam transformer integrated on 3DIC packag...

Packages with multiple types of underfill and method forming the same

Joint structure in semiconductor package and manufacturing method t...

Connector

Package structure and method of fabricating the same

Photonic chip coupler connector module

Semiconductor package and method of forming the same

Systems and methods for humidity control of FOUP during semiconduct...

Connector

Chip package structure

Integrated circuit package and method of forming same

Method of fabricating semiconductor structure

Semiconductor die package and method of manufacture

Thermal interface material having different thicknesses in packages

Photonic semiconductor device and method of manufacture

Semiconductor package, integrated optical communication system

Package structure and fabricating method thereof

Semiconductor package and method of forming the same

Semiconductor package, integrated optical communication system

Electronic device

Optical waveguide connection assembly and optical module comprising...

Patents Applicationslast 30 patents

Laminar Gas Flow Filter

SEMICONDUCTOR DEVICE

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

E-PAPER DISPLAY PANEL

PHOTONIC SILICON SPATIAL BEAM TRANSFORMER INTEGRATED ON 3DIC PACKAG...

BIPOLAR JUNCTION TRANSISTOR WITH LATERAL AND VERTICAL CONDUCTING PATHS

SEMICONDUCTOR PACKAGE

OPTICAL TRANSCEIVER AND MANUFACTURING METHOD THEREOF

DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION

PHOTONIC CHIP COUPLER CONNECTOR MODULE

METHOD OF FABRICATING PACKAGE STRUCTURE

SYSTEMS AND METHODS FOR HUMIDITY CONTROL OF FOUP DURING SEMICONDUCT...

JOINT STRUCTURE IN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD T...

METHOD FOP FORMING MEMORY DEVICE

INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME

ATRIAL HIGH RATE EPISODE PREDICTION MODEL TRAINING METHOD AND APPAR...

TRANSIENT VOLTAGE SUPPRESSOR WITH ADJUSTABLE TRIGGER AND HOLDING VO...

THERMAL INTERFACE MATERIAL HAVING DIFFERENT THICKNESSES IN PACKAGES

PHOTONIC SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

CHIP PACKAGE AND METHODS FOR FORMING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

EXHAUST MANIFOLD FOR SEMICONDUCTOR PROCESS CHAMBER

PACKAGES WITH MULTIPLE TYPES OF UNDERFILL AND METHOD FORMING THE SAME

SEMICONDUCTOR DIE PACKAGE AND METHOD OF MANUFACTURE

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Optical Transceiver and Manufacturing Method Thereof

PACKAGE STRUCTURE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

DEVICE AND METHODS FOR CHEMICAL VAPOR DEPOSITION

DEFLECTOR FOR CHAMBER CLEANING