Sung Sik Jang

Follow

Person

Hanam, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having improved adhesiveness and ground bonding
- Patent number 7,535,085
- Issue date May 19, 2009
- Amkor Technology, Inc.
- Sung Sik Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved adhesiveness and ground bonding
- Patent number 7,067,908
- Issue date Jun 27, 2006
- Amkor Technology, Inc.
- Sung Sik Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and semiconductor package made using the leadframe
- Patent number 7,042,068
- Issue date May 9, 2006
- Amkor Technology, Inc.
- Byung Hoon Ahn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe including corner leads and semiconductor package using same
- Patent number 6,867,071
- Issue date Mar 15, 2005
- Amkor Technology, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having improved adhesiveness and ground bonding
- Patent number 6,853,059
- Issue date Feb 8, 2005
- Amkor Technology, Inc.
- Sung Sik Jang
- H01 - BASIC ELECTRIC ELEMENTS