Sung-Woo HYUN

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packages
- Patent number 10,741,529
- Issue date Aug 11, 2020
- SK HYNIX, INC.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 10,224,314
- Issue date Mar 5, 2019
- SK hynix Inc.
- Won Duck Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of fabricating the same
- Patent number 9,112,055
- Issue date Aug 18, 2015
- Samsung Electronics Co., Ltd.
- Sung-Woo Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module substrate with feature for replacement of faulty chips, semi...
- Patent number 8,829,689
- Issue date Sep 9, 2014
- SK Hynix Inc.
- Ki Young Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump for semiconductor package, semiconductor package having bump,...
- Patent number 8,823,183
- Issue date Sep 2, 2014
- SK Hynix Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including trenches having particular structures
- Patent number 8,604,551
- Issue date Dec 10, 2013
- Samsung Electronics Co., Ltd.
- Sung-Woo Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device including forming tren...
- Patent number 8,415,224
- Issue date Apr 9, 2013
- Samsung Electronics Co., Ltd.
- Sung-Woo Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package requiring reduced manufacturing processes
- Patent number 8,399,998
- Issue date Mar 19, 2013
- Hynix Semiconductor Inc.
- Ki Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating vertical semiconductor device utilizing phas...
- Patent number 8,236,673
- Issue date Aug 7, 2012
- Samsung Electronics Co., Ltd.
- Yong-hoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-based photonic device package module
- Patent number 8,120,045
- Issue date Feb 21, 2012
- Wavenics Inc.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thinned wafer having stress dispersion parts and method for manufac...
- Patent number 7,800,201
- Issue date Sep 21, 2010
- Hynix Semiconductor Inc.
- Sung Ho Hyun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20190139940
- Publication date May 9, 2019
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20170309600
- Publication date Oct 26, 2017
- SK HYNIX INC.
- Won Duck JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20130280871
- Publication date Oct 24, 2013
- Samsung Electronics Co., Ltd.
- Sung-Woo Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING TRENCHES HAVING PARTICULAR STRUCTURES
- Publication number 20130228870
- Publication date Sep 5, 2013
- Samsung Electronics Co., Ltd.
- Sung-Woo HYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE
- Publication number 20120112342
- Publication date May 10, 2012
- Hynix Semiconductor Inc.
- Sung Ho HYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...
- Publication number 20120091584
- Publication date Apr 19, 2012
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120049285
- Publication date Mar 1, 2012
- Sung-Woo Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDU...
- Publication number 20110309529
- Publication date Dec 22, 2011
- Hynix Semiconductor Inc.
- Ki Young KIM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FABRICATING VERTICAL SEMICONDUCTOR DEVICE UTILIZING PHAS...
- Publication number 20110217828
- Publication date Sep 8, 2011
- SAMSUNG ELECTRONICS CO., LTD.
- Yong-hoon Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR CELL ARRAY REGION, METHOD OF FOR...
- Publication number 20110177671
- Publication date Jul 21, 2011
- Sung-Woo HYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE REQUIRING REDUCED MANUFACTURING PROCESSES
- Publication number 20110031604
- Publication date Feb 10, 2011
- Hynix Semiconductor Inc.
- Ki Young KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD...
- Publication number 20100133557
- Publication date Jun 3, 2010
- WAVENICS INC.
- Young-Se Kwon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THINNED WAFER HAVING STRESS DISPERSION PARTS AND METHOD FOR MANUFAC...
- Publication number 20090001520
- Publication date Jan 1, 2009
- Sung Ho Hyun
- H01 - BASIC ELECTRIC ELEMENTS

Sung-Woo HYUN

Person

Patents Grantslast 30 patents

Semiconductor packages

Semiconductor packages

Semiconductor device and method of fabricating the same

Module substrate with feature for replacement of faulty chips, semi...

Bump for semiconductor package, semiconductor package having bump,...

Semiconductor device including trenches having particular structures

Method of fabricating a semiconductor device including forming tren...

Semiconductor package requiring reduced manufacturing processes

Methods of fabricating vertical semiconductor device utilizing phas...

Metal-based photonic device package module

Thinned wafer having stress dispersion parts and method for manufac...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGES

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE INCLUDING TRENCHES HAVING PARTICULAR STRUCTURES

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

BUMP FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE HAVING BUMP,...

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

MODULE SUBSTRATE THAT ALLOWS REPLACEMENT OF FAULTY CHIPS, SEMICONDU...

METHODS OF FABRICATING VERTICAL SEMICONDUCTOR DEVICE UTILIZING PHAS...

METHODS OF FORMING A SEMICONDUCTOR CELL ARRAY REGION, METHOD OF FOR...

SEMICONDUCTOR PACKAGE REQUIRING REDUCED MANUFACTURING PROCESSES

METAL-BASED PHOTONIC DEVICE PACKAGE MODULE AND MANUFACTURING METHOD...

THINNED WAFER HAVING STRESS DISPERSION PARTS AND METHOD FOR MANUFAC...