Sung-Yen YEH

Person

Jiadong Township, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package
- Patent number 11,978,716
- Issue date May 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method of the same
- Patent number 11,967,553
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package device
- Patent number 11,955,433
- Issue date Apr 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor structure
- Patent number 11,916,012
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing
- Patent number 11,916,031
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chia Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System on integrated chips (SoIC) and semiconductor structures with...
- Patent number 11,894,309
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices with system on chip devices
- Patent number 11,856,800
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure for heat dissipation
- Patent number 11,854,785
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 11,855,042
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method
- Patent number 11,854,921
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Layout context-based cell timing characterization
- Patent number 11,853,676
- Issue date Dec 26, 2023
- Taiwan Semiconductor Manufacturing Company Ltd.
- Zhe-Wei Jiang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuit package and method
- Patent number 11,848,246
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,837,578
- Issue date Dec 5, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for context aware circuit design
- Patent number 11,816,413
- Issue date Nov 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,810,897
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3DIC formation with dies bonded to formed RDLs
- Patent number 11,810,899
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit in hybrid row height structure
- Patent number 11,791,213
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jerry Chang-Jui Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit testing and manufacture using multiple timing libraries
- Patent number 11,783,106
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ravi Babu Pittu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Stacking structure, package structure and method of fabricating the...
- Patent number 11,784,163
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inactive structure on SoIC
- Patent number 11,756,933
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding structure and method of forming same
- Patent number 11,756,907
- Issue date Sep 12, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages
- Patent number 11,742,297
- Issue date Aug 29, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages with stacked dies and methods of forming the...
- Patent number 11,735,544
- Issue date Aug 22, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,728,275
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming semiconductor device package having testing pads...
- Patent number 11,721,598
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-level stacking of wafers and chips
- Patent number 11,721,663
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer on wafer bonding structure
- Patent number 11,715,723
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,705,423
- Issue date Jul 18, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package and manufacturing method thereof
- Patent number 11,699,638
- Issue date Jul 11, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method of manufacturing the same
- Patent number 11,676,942
- Issue date Jun 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System on Integrated Chips (SoIC) and Semiconductor Structures with...
- Publication number 20240153881
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION
- Publication number 20240095434
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- ZHE-WEI JIANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240088048
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Chiang Ting
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079364
- Publication date Mar 7, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Structures and Methods of Forming the Same
- Publication number 20240079391
- Publication date Mar 7, 2024
- Taiwan Semiconductor Mqanufacturing Co., Ltd.
- Chia-Hao Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240055371
- Publication date Feb 15, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package and Method of Forming the Same
- Publication number 20240047417
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240047422
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240030186
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20240030069
- Publication date Jan 25, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME
- Publication number 20240021576
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...
- Publication number 20240021584
- Publication date Jan 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN
- Publication number 20230401369
- Publication date Dec 14, 2023
- TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Li-Chung Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
System Formed Through Package-In-Package Formation
- Publication number 20230387082
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD
- Publication number 20230378015
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE
- Publication number 20230377976
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jerry Chang-Jui KAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20230378131
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230378012
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20230369262
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...
- Publication number 20230361086
- Publication date Nov 9, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES
- Publication number 20230352419
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES
- Publication number 20230352352
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Level Stacking of Wafers and Chips
- Publication number 20230352439
- Publication date Nov 2, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20230343737
- Publication date Oct 26, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20230335534
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Der-Chyang Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE FOR HEAT DISSIPATION
- Publication number 20230326825
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Co, LTD.
- Chen-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230307417
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230307306
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE
- Publication number 20230307410
- Publication date Sep 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Feng Yeh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230298973
- Publication date Sep 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Fa Chen
- H01 - BASIC ELECTRIC ELEMENTS

Sung-Yen YEH

Person

Patents Grantslast 30 patents

Package

Semiconductor package and manufacturing method of the same

Package-on-package device

Manufacturing method of semiconductor structure

Semiconductor device and method of manufacturing

System on integrated chips (SoIC) and semiconductor structures with...

Semiconductor devices with system on chip devices

Package structure for heat dissipation

Method of manufacturing semiconductor structure

Integrated circuit package and method

Layout context-based cell timing characterization

Integrated circuit package and method

Package structure

Systems and methods for context aware circuit design

Package structure and method of fabricating the same

3DIC formation with dies bonded to formed RDLs

Integrated circuit in hybrid row height structure

Circuit testing and manufacture using multiple timing libraries

Stacking structure, package structure and method of fabricating the...

Inactive structure on SoIC

Bonding structure and method of forming same

Semiconductor packages

Semiconductor packages with stacked dies and methods of forming the...

Semiconductor package and manufacturing method thereof

Method of forming semiconductor device package having testing pads...

Multi-level stacking of wafers and chips

Wafer on wafer bonding structure

Package structure

Package and manufacturing method thereof

Semiconductor structure and method of manufacturing the same

Patents Applicationslast 30 patents

System on Integrated Chips (SoIC) and Semiconductor Structures with...

LAYOUT CONTEXT-BASED CELL TIMING CHARACTERIZATION

CHIP STRUCTURE AND METHOD OF FABRICATING THE SAME

Die Structures and Methods of Forming the Same

Die Structures and Methods of Forming the Same

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

Integrated Circuit Package and Method of Forming the Same

PACKAGE STRUCTURE

PACKAGE AND MANUFACTURING METHOD THEREOF

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

THROUGH-DIELECTRIC VIAS FOR DIRECT CONNECTION AND METHOD FORMING SAME

METHODS OF FABRICATING THE SAME DIE STACK STRUCTURE AND SEMICONDUCT...

SYSTEMS AND METHODS FOR CONTEXT AWARE CIRCUIT DESIGN

System Formed Through Package-In-Package Formation

INTEGRATED CIRCUIT PACKAGE AND METHOD

INTEGRATED CIRCUIT IN HYBRID ROW HEIGHT STRUCTURE

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated Circuit Packages and Methods of Forming the Same

BONDING STRUCTURE AND METHOD OF FORMING SAME

STACKING STRUCTURE, PACKAGE STRUCTURE AND METHOD OF FABRICATING THE...

SEMICONDUCTOR PACKAGES

METHODS OF FORMING SEMICONDUCTOR DEVICE PACKAGES

Multi-Level Stacking of Wafers and Chips

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

Integrated Circuit Packages and Methods of Forming the Same

PACKAGE STRUCTURE FOR HEAT DISSIPATION

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE

PACKAGE AND MANUFACTURING METHOD THEREOF