Sunghawn BAE

Follow

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package
- Patent number 12,243,791
- Issue date Mar 4, 2025
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,881,472
- Issue date Jan 23, 2024
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,393,795
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Yongjin Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and package-on-package devices including same
- Patent number 11,393,767
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,342,239
- Issue date May 24, 2022
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out semiconductor package having metal pattern layer electrical...
- Patent number 11,152,292
- Issue date Oct 19, 2021
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220367417
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220278011
- Publication date Sep 1, 2022
- Samsung Electronics Co., Ltd.
- Sunghawn BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210257337
- Publication date Aug 19, 2021
- Samsung Electronics Co., Ltd.
- Yongjin PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE DEVICES INCLUDING SAME
- Publication number 20210225773
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- SUNGHAWN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT SEMICONDUCTOR PACKAGE
- Publication number 20200168537
- Publication date May 28, 2020
- Samsung Electronics Co., Ltd.
- Sunghawn BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20200152535
- Publication date May 14, 2020
- Samsung Electronics Co., Ltd.
- Sunghawn BAE
- H01 - BASIC ELECTRIC ELEMENTS