Sunghoan KIM

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and package-on-package devices including same
- Patent number 11,393,767
- Issue date Jul 19, 2022
- Samsung Electronics Co., Ltd.
- Sunghawn Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing connection structure of semiconductor chip...
- Patent number 11,264,339
- Issue date Mar 1, 2022
- Samsung Electronics Co., Ltd.
- Gyujin Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND PACKAGE-ON-PACKAGE DEVICES INCLUDING SAME
- Publication number 20210225773
- Publication date Jul 22, 2021
- Samsung Electronics Co., Ltd.
- SUNGHAWN BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING CONNECTION STRUCTURE OF SEMICONDUCTOR CHIP...
- Publication number 20200273817
- Publication date Aug 27, 2020
- Samsung Electronics Co., Ltd.
- Gyujin CHOI
- H01 - BASIC ELECTRIC ELEMENTS