Sunghwan MIN

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Sunnyvale, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuits with internal pads
- Patent number 9,391,032
- Issue date Jul 12, 2016
- Samsung Electronics Co., Ltd.
- Young Koog
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
OPTICALLY INTERCONNECTED PROCESSOR AND MEMORY MODULES
- Publication number 20250110299
- Publication date Apr 3, 2025
- AvicenaTech, Corp.
- Robert Kalman
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FIBER-OPTIC BUNDLES FOR PARALLEL OPTICAL INTERCONNECTS
- Publication number 20250060544
- Publication date Feb 20, 2025
- Howard Rourke
- G02 - OPTICS
Information Patent Application
ENHANCED MICRO-OPTICAL STRUCTURES FOR PARALLEL MICROLED LINKS
- Publication number 20240385394
- Publication date Nov 21, 2024
- Rowan Pocock
- G02 - OPTICS
Information Patent Application
OPTICALLY INTERCONNECTED HIGH BANDWIDTH MEMORY ARCHITECTURES
- Publication number 20240345344
- Publication date Oct 17, 2024
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
PACKAGING MICROLED OPTICAL INTERCONNECTS
- Publication number 20230258888
- Publication date Aug 17, 2023
- Sunghwan Min
- G02 - OPTICS
Information Patent Application
THERMALLY ENHANCED PACKAGE-ON-PACKAGE STRUCTURE
- Publication number 20160276308
- Publication date Sep 22, 2016
- Samsung Electronics Co., Ltd.
- Sunghwan MIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS WITH INTERNAL PADS
- Publication number 20150145122
- Publication date May 28, 2015
- Samsung Electronics Co., Ltd.
- Young KOOG
- H01 - BASIC ELECTRIC ELEMENTS