Sungjin KIM

Person

SUWANEE, GA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Packaging substrate and method for manufacturing same
- Patent number 12,198,994
- Issue date Jan 14, 2025
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and semiconductor apparatus comprising same
- Patent number 12,165,979
- Issue date Dec 10, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 12,027,454
- Issue date Jul 2, 2024
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Loading cassette for substrate including glass and substrate loadin...
- Patent number 11,981,501
- Issue date May 14, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate, and semiconductor device comprising same
- Patent number 11,967,542
- Issue date Apr 23, 2024
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 11,728,259
- Issue date Aug 15, 2023
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate with core layer and cavity structure and semico...
- Patent number 11,652,039
- Issue date May 16, 2023
- ABSOLICS INC.
- Sungjin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate having electric power transmitting elements on...
- Patent number 11,469,167
- Issue date Oct 11, 2022
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging glass substrate for semiconductor, a packaging substrate...
- Patent number 11,437,308
- Issue date Sep 6, 2022
- ABSOLICS INC.
- Youngho Rho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING THE SAME
- Publication number 20240336519
- Publication date Oct 10, 2024
- ABSOLICS INC.
- Sungjin KIM
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
SEMICONDUCTOR PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGES, AND METH...
- Publication number 20240186232
- Publication date Jun 6, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME
- Publication number 20240170379
- Publication date May 23, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20240170361
- Publication date May 23, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate and semiconductor module
- Publication number 20240162167
- Publication date May 16, 2024
- ABSOLICS INC.
- Tae Kyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20240128177
- Publication date Apr 18, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PRE...
- Publication number 20240096724
- Publication date Mar 21, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA CONNECTION STRUCTURE COMPRISING MULTIPLE VIAS AND SUBSTRATE COM...
- Publication number 20240021507
- Publication date Jan 18, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND...
- Publication number 20240021508
- Publication date Jan 18, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE CARRIER AND SUBSTRATE ASSEMBLY COMPRISING THE SAME
- Publication number 20240006224
- Publication date Jan 4, 2024
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFAC...
- Publication number 20230411172
- Publication date Dec 21, 2023
- ABSOLICS INC.
- Sungjin KIM
- B08 - CLEANING
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20230207442
- Publication date Jun 29, 2023
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE COMPRISING A LID STRUCTURE, PACKAGE SUBSTRATE COMPRISING...
- Publication number 20230028070
- Publication date Jan 26, 2023
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20220352062
- Publication date Nov 3, 2022
- ABSOLICS INC.
- Youngho RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20220165650
- Publication date May 26, 2022
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20220148942
- Publication date May 12, 2022
- ABSOLICS INC.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20220059421
- Publication date Feb 24, 2022
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20220051972
- Publication date Feb 17, 2022
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOADING CASSETTE FOR SUBSTRATE INCLUDING GLASS AND SUBSTRATE LOADIN...
- Publication number 20220048699
- Publication date Feb 17, 2022
- SKC CO., LTD.
- Sungjin KIM
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
PACKAGING GLASS SUBSTRATE FOR SEMICONDUCTOR, A PACKAGING SUBSTRATE...
- Publication number 20210398891
- Publication date Dec 23, 2021
- SKC Co, Ltd.
- Youngho RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME
- Publication number 20210391243
- Publication date Dec 16, 2021
- SKC CO., LTD.
- Youngho RHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME
- Publication number 20210384131
- Publication date Dec 9, 2021
- SKC CO., LTD.
- Sungjin KIM
- H01 - BASIC ELECTRIC ELEMENTS

Sungjin KIM

Person

Patents Grantslast 30 patents

Packaging substrate and method for manufacturing same

Packaging substrate and semiconductor apparatus comprising same

Packaging substrate having electric power transmitting elements on...

Loading cassette for substrate including glass and substrate loadin...

Packaging substrate, and semiconductor device comprising same

Packaging substrate having electric power transmitting elements on...

Packaging substrate with core layer and cavity structure and semico...

Packaging substrate having electric power transmitting elements on...

Packaging glass substrate for semiconductor, a packaging substrate...

Patents Applicationslast 30 patents

SUBSTRATE AND PACKAGE SUBSTRATE COMPRISING THE SAME

SEMICONDUCTOR PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGES, AND METH...

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE COMPRISING THE SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

Substrate and semiconductor module

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME

PACKAGING SUBSTRATE, SEMICONDUCTOR PACKAGE, PACKAGING SUBSTRATE PRE...

VIA CONNECTION STRUCTURE COMPRISING MULTIPLE VIAS AND SUBSTRATE COM...

DEVICE PACKAGING SUBSTRATE, MANUFACTURING METHOD FOR THE SAME, AND...

SUBSTRATE CARRIER AND SUBSTRATE ASSEMBLY COMPRISING THE SAME

CLEANED PACKAGING SUBSTRATE AND CLEANED PACKAGING SUBSTRATE MANUFAC...

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

SUBSTRATE COMPRISING A LID STRUCTURE, PACKAGE SUBSTRATE COMPRISING...

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME

PACKAGING SUBSTRATE, AND SEMICONDUCTOR DEVICE COMPRISING SAME

PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

LOADING CASSETTE FOR SUBSTRATE INCLUDING GLASS AND SUBSTRATE LOADIN...

PACKAGING GLASS SUBSTRATE FOR SEMICONDUCTOR, A PACKAGING SUBSTRATE...

PACKAGING SUBSTRATE AND SEMICONDUCTOR DEVICE COMPRISING SAME

PACKAGING SUBSTRATE AND SEMICONDUCTOR APPARATUS COMPRISING SAME