Sungjun Im

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San Jose, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
System and method to enhance reliability in connection with arrange...
- Patent number 11,264,301
- Issue date Mar 1, 2022
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 11,094,604
- Issue date Aug 17, 2021
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method to enhance solder joint reliability
- Patent number 10,636,722
- Issue date Apr 28, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT DEVICE WITH RAISED LID ATTACH AREA
- Publication number 20250157864
- Publication date May 15, 2025
- ADVANCED MICRO DEVICES, INC.
- Chia-Chun MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REMOVING CONDUCTIVE MATERIAL FROM A PEDESTAL OF A SEMICONDUCTOR LID...
- Publication number 20250006496
- Publication date Jan 2, 2025
- ADVANCED MICRO DEVICES, INC.
- CHIA CHUN MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method to Enhance Solder Joint Reliability
- Publication number 20200219787
- Publication date Jul 9, 2020
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190326194
- Publication date Oct 24, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD TO ENHANCE SOLDER JOINT RELIABILITY
- Publication number 20190096783
- Publication date Mar 28, 2019
- Western Digital Technologies, Inc.
- Lee Kong Yu
- H01 - BASIC ELECTRIC ELEMENTS