Sungmin Song

Person

Inchon, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit packaging system with molded laser via interpose...
- Patent number 10,083,903
- Issue date Sep 25, 2018
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with molded laser via interpose...
- Patent number 9,385,066
- Issue date Jul 5, 2016
- STATS ChipPAC Pte. Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system with redistribution and...
- Patent number 9,355,962
- Issue date May 31, 2016
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with multi-chip module
- Patent number 9,330,945
- Issue date May 3, 2016
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer shield and meth...
- Patent number 8,779,562
- Issue date Jul 15, 2014
- Stats Chippac Ltd.
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing mold flash prevention t...
- Patent number 8,772,916
- Issue date Jul 8, 2014
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing an integrated circuit packaging system incl...
- Patent number 8,765,525
- Issue date Jul 1, 2014
- Stats Chippac Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with wafer scale heat slug
- Patent number 8,618,653
- Issue date Dec 31, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with collapsed multi-integratio...
- Patent number 8,569,882
- Issue date Oct 29, 2013
- Stats Chippac Ltd.
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection and met...
- Patent number 8,501,535
- Issue date Aug 6, 2013
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system employing mold flash prevention t...
- Patent number 8,252,615
- Issue date Aug 28, 2012
- Stats Chippac Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 8,227,925
- Issue date Jul 24, 2012
- Stats Chippac Ltd.
- Sungmin Song
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package system and method of package stacking
- Patent number 8,130,512
- Issue date Mar 6, 2012
- Stats Chippac Ltd.
- In Sang Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit packaging system with interposer
- Patent number 8,124,451
- Issue date Feb 28, 2012
- Stats Chippac Ltd.
- Sungmin Song
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Integrated circuit package system for stackable devices
- Patent number 7,919,871
- Issue date Apr 5, 2011
- Stats Chippac Ltd.
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with dual side connection
- Patent number 7,884,457
- Issue date Feb 8, 2011
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package system with intra-stack encapsul...
- Patent number 7,871,861
- Issue date Jan 18, 2011
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package system with mold lock subassembly
- Patent number 7,667,314
- Issue date Feb 23, 2010
- Stats Chippac Ltd.
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,482,203
- Issue date Jan 27, 2009
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system
- Patent number 7,312,519
- Issue date Dec 25, 2007
- Stats Chippac Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked integrated circuit package-in-package system with recessed...
- Patent number 7,298,037
- Issue date Nov 20, 2007
- Stats Chippac Ltd.
- Choong Bin Yim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSE...
- Publication number 20120319265
- Publication date Dec 20, 2012
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...
- Publication number 20120267801
- Publication date Oct 25, 2012
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METH...
- Publication number 20120241921
- Publication date Sep 27, 2012
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...
- Publication number 20120241980
- Publication date Sep 27, 2012
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20120146243
- Publication date Jun 14, 2012
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...
- Publication number 20110115098
- Publication date May 19, 2011
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND...
- Publication number 20100314741
- Publication date Dec 16, 2010
- SeongMin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING
- Publication number 20100123233
- Publication date May 20, 2010
- In Sang Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSUL...
- Publication number 20090321908
- Publication date Dec 31, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES
- Publication number 20090236753
- Publication date Sep 24, 2009
- DongSoo Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG
- Publication number 20090189275
- Publication date Jul 30, 2009
- WonJun Ko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD LOCK SUBASSEMBLY
- Publication number 20090085199
- Publication date Apr 2, 2009
- In Sang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER
- Publication number 20090079091
- Publication date Mar 26, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE
- Publication number 20090072375
- Publication date Mar 19, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION
- Publication number 20090001612
- Publication date Jan 1, 2009
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...
- Publication number 20080150119
- Publication date Jun 26, 2008
- STATS ChipPAC Ltd.
- Ki Youn Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20080105965
- Publication date May 8, 2008
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked integrated circuit package-in-package system
- Publication number 20070158810
- Publication date Jul 12, 2007
- STATS ChipPAC Ltd.
- Sungmin Song
- H01 - BASIC ELECTRIC ELEMENTS

Sungmin Song

Person

Patents Grantslast 30 patents

Integrated circuit packaging system with molded laser via interpose...

Integrated circuit packaging system with molded laser via interpose...

Integrated circuit package stacking system with redistribution and...

Integrated circuit package system with multi-chip module

Integrated circuit packaging system with interposer shield and meth...

Integrated circuit package system employing mold flash prevention t...

Method of manufacturing an integrated circuit packaging system incl...

Integrated circuit package system with wafer scale heat slug

Integrated circuit packaging system with collapsed multi-integratio...

Integrated circuit package system with dual side connection and met...

Integrated circuit package system employing mold flash prevention t...

Integrated circuit packaging system with interposer

Integrated circuit package system and method of package stacking

Integrated circuit packaging system with interposer

Integrated circuit package system for stackable devices

Integrated circuit package system with dual side connection

Stacked integrated circuit package system with intra-stack encapsul...

Integrated circuit package system with mold lock subassembly

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system with recessed...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH MOLDED LASER VIA INTERPOSE...

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER SHIELD AND METH...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH COLLAPSED MULTI-INTEGRATIO...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION AND MET...

INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND...

INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF PACKAGE STACKING

STACKED INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTRA-STACK ENCAPSUL...

INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFER SCALE HEAT SLUG

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLD LOCK SUBASSEMBLY

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-CHIP MODULE

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL SIDE CONNECTION

INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING MOLD FLASH PREVENTION T...

Stacked integrated circuit package-in-package system

Stacked integrated circuit package-in-package system