SungWon Cho

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 12,211,804
- Issue date Jan 28, 2025
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,935,840
- Issue date Mar 19, 2024
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 11,784,133
- Issue date Oct 10, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor packages with open terminals and methods of...
- Patent number 11,728,281
- Issue date Aug 15, 2023
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Emi shielding for flip chip package with exposed die backside
- Patent number 11,688,697
- Issue date Jun 27, 2023
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor devices
- Patent number 11,450,610
- Issue date Sep 20, 2022
- Samsung Electronics Co., Ltd.
- Seung Hyun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 11,444,035
- Issue date Sep 13, 2022
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,355,452
- Issue date Jun 7, 2022
- STATS ChipPAC Pte. Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,342,278
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,145,603
- Issue date Oct 12, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding and method of makin...
- Patent number 11,088,082
- Issue date Aug 10, 2021
- STATS ChipPAC Pte. Ltd.
- Changoh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for processing audio signal
- Patent number 11,056,094
- Issue date Jul 6, 2021
- Samsung Electronics Co., Ltd.
- Jinho Park
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 11,024,585
- Issue date Jun 1, 2021
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor packages with open terminals and methods of...
- Patent number 10,985,109
- Issue date Apr 20, 2021
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded semiconductor package with open terminal and methods of ma...
- Patent number 10,910,322
- Issue date Feb 2, 2021
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 10,804,217
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partial EMI shielding removal using laser...
- Patent number 10,784,210
- Issue date Sep 22, 2020
- STATS ChipPAC Pte. Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming magnetic field shielding...
- Patent number 10,388,611
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- Sungwon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with shielding and method of ma...
- Patent number 9,997,468
- Issue date Jun 12, 2018
- STATS ChipPAC Pte. Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 9,780,063
- Issue date Oct 3, 2017
- STATS ChipPAC Pte. Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming interconnect structure w...
- Patent number 9,373,578
- Issue date Jun 21, 2016
- STATS ChipPAC Pte. Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for predicting potential change of coronary ar...
- Patent number 9,324,035
- Issue date Apr 26, 2016
- Samsung Electronics Co., Ltd.
- Ji-Hyun Lee
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method of forming POP with stacked semicon...
- Patent number 9,324,659
- Issue date Apr 26, 2016
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of integrated circuit packaging system with p...
- Patent number 9,093,278
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with vertical interconnection a...
- Patent number 9,093,392
- Issue date Jul 28, 2015
- Stats Chippac Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with posts and method of manufa...
- Patent number 9,082,887
- Issue date Jul 14, 2015
- Stats Chippac Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming column interconnect stru...
- Patent number 8,901,734
- Issue date Dec 2, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming vertically offset conduc...
- Patent number 8,896,133
- Issue date Nov 25, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming bump structure with insu...
- Patent number 8,835,301
- Issue date Sep 16, 2014
- STATS ChipPAC, Ltd.
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA
- Publication number 20250014871
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Sungwon CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA DENSITY MEASUREMENT SENSOR, APPARATUS FOR MEASURING REAL-TIM...
- Publication number 20240274418
- Publication date Aug 15, 2024
- Samsung Electronics Co., Ltd.
- Sungho Jang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20240170416
- Publication date May 23, 2024
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASMA SENSOR MODULE
- Publication number 20240071737
- Publication date Feb 29, 2024
- Samsung Electronics Co., Ltd.
- Sungwon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Package with Open Terminal and Methods of Ma...
- Publication number 20230402401
- Publication date Dec 14, 2023
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20220384360
- Publication date Dec 1, 2022
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220270983
- Publication date Aug 25, 2022
- STATS ChipPAC Pte Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220246541
- Publication date Aug 4, 2022
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICE AND SYSTEM INCLUDING THE SAME
- Publication number 20210399010
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Junhyoung KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding and Method of Makin...
- Publication number 20210335724
- Publication date Oct 28, 2021
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Packages with Open Terminals and Methods of...
- Publication number 20210210437
- Publication date Jul 8, 2021
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Package with Open Terminal and Methods of Ma...
- Publication number 20210118810
- Publication date Apr 22, 2021
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICES
- Publication number 20210043568
- Publication date Feb 11, 2021
- Samsung Electronics Co., Ltd.
- Seung HYUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20210028122
- Publication date Jan 28, 2021
- STATS ChipPAC Pte Ltd.
- Dong Won Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200395312
- Publication date Dec 17, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20200373249
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Packages with Open Terminals and Methods of...
- Publication number 20200211977
- Publication date Jul 2, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding Removal Using Laser...
- Publication number 20200211976
- Publication date Jul 2, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Shielded Semiconductor Package with Open Terminal and Methods of Ma...
- Publication number 20200194379
- Publication date Jun 18, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device with Partial EMI Shielding and Method of Makin...
- Publication number 20200075502
- Publication date Mar 5, 2020
- STATS ChipPAC Pte Ltd.
- ChangOh Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200051926
- Publication date Feb 13, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR PROCESSING AUDIO SIGNAL
- Publication number 20200027437
- Publication date Jan 23, 2020
- Samsung Electronics Co., Ltd.
- Jinho PARK
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294236
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20180294235
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Magnetic Field Shielding...
- Publication number 20180261550
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- Sungwon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...
- Publication number 20160300799
- Publication date Oct 13, 2016
- Byung Joon Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Bump Structure with Insu...
- Publication number 20140319680
- Publication date Oct 30, 2014
- JoonYoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Interconnect Structure w...
- Publication number 20140175642
- Publication date Jun 26, 2014
- STATS ChipPAC, Ltd.
- DaeSik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Electrical Interconnecti...
- Publication number 20140008783
- Publication date Jan 9, 2014
- STATS ChipPAC, Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHOD FOR PREDICTING POTENTIAL CHANGE OF CORONARY AR...
- Publication number 20130275347
- Publication date Oct 17, 2013
- Ji-Hyun Lee
- G06 - COMPUTING CALCULATING COUNTING

SungWon Cho

Person

Patents Grantslast 30 patents

Semiconductor device with partial EMI shielding removal using laser...

Semiconductor device with partial EMI shielding removal using laser...

Shielded semiconductor package with open terminal and methods of ma...

Shielded semiconductor packages with open terminals and methods of...

EMI shielding for flip chip package with exposed die backside

Emi shielding for flip chip package with exposed die backside

Vertical semiconductor devices

Semiconductor device with partial EMI shielding removal using laser...

EMI shielding for flip chip package with exposed die backside

EMI shielding for flip chip package with exposed die backside

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device with partial EMI shielding and method of makin...

Method and apparatus for processing audio signal

Integrated circuit packaging system with shielding and method of ma...

Shielded semiconductor packages with open terminals and methods of...

Shielded semiconductor package with open terminal and methods of ma...

EMI shielding for flip chip package with exposed die backside

Semiconductor device with partial EMI shielding removal using laser...

Semiconductor device and method of forming magnetic field shielding...

Integrated circuit packaging system with shielding and method of ma...

Semiconductor device and method of forming bump structure with insu...

Semiconductor device and method of forming interconnect structure w...

Apparatus and method for predicting potential change of coronary ar...

Semiconductor device and method of forming POP with stacked semicon...

Method of manufacture of integrated circuit packaging system with p...

Integrated circuit packaging system with vertical interconnection a...

Integrated circuit packaging system with posts and method of manufa...

Semiconductor device and method of forming column interconnect stru...

Semiconductor device and method of forming vertically offset conduc...

Semiconductor device and method of forming bump structure with insu...

Patents Applicationslast 30 patents

SEMICONDUCTOR PROCESSING APPARATUS USING PLASMA

PLASMA DENSITY MEASUREMENT SENSOR, APPARATUS FOR MEASURING REAL-TIM...

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

PLASMA SENSOR MODULE

Shielded Semiconductor Package with Open Terminal and Methods of Ma...

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

EMI Shielding for Flip Chip Package with Exposed Die Backside

EMI Shielding for Flip Chip Package with Exposed Die Backside

MEMORY DEVICE AND SYSTEM INCLUDING THE SAME

Semiconductor Device with Partial EMI Shielding and Method of Makin...

Shielded Semiconductor Packages with Open Terminals and Methods of...

Shielded Semiconductor Package with Open Terminal and Methods of Ma...

VERTICAL SEMICONDUCTOR DEVICES

EMI Shielding for Flip Chip Package with Exposed Die Backside

EMI Shielding for Flip Chip Package with Exposed Die Backside

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

Shielded Semiconductor Packages with Open Terminals and Methods of...

Semiconductor Device with Partial EMI Shielding Removal Using Laser...

Shielded Semiconductor Package with Open Terminal and Methods of Ma...

Semiconductor Device with Partial EMI Shielding and Method of Makin...

EMI Shielding for Flip Chip Package with Exposed Die Backside

METHOD AND APPARATUS FOR PROCESSING AUDIO SIGNAL

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming Magnetic Field Shielding...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SHIELDING AND METHOD OF MA...

Semiconductor Device and Method of Forming Bump Structure with Insu...

Semiconductor Device and Method of Forming Interconnect Structure w...

Semiconductor Device and Method of Forming Electrical Interconnecti...

APPARATUS AND METHOD FOR PREDICTING POTENTIAL CHANGE OF CORONARY AR...