Sungyoon RYU

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Test apparatus and test method thereof
- Patent number 12,092,656
- Issue date Sep 17, 2024
- Samsung Electronics Co., Ltd.
- Sungyoon Ryu
- G01 - MEASURING TESTING
Information Patent Grant
Through-focus image-based metrology device, operation method thereo...
- Patent number 11,988,495
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- G01 - MEASURING TESTING
Information Patent Grant
Inspection system including reference specimen and method of formin...
- Patent number 11,921,270
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sungil Choi
- G01 - MEASURING TESTING
Information Patent Grant
Wafer inspection device and method of manufacturing semiconductor d...
- Patent number 11,428,645
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Kihak Nam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DEFECT DETECTION DEVICE AND DEFECT DETECTION METHOD
- Publication number 20240255439
- Publication date Aug 1, 2024
- Samsung Electronics Co., Ltd.
- Heeyoon Han
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD
- Publication number 20240230528
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Sunhong Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSPECTION METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY...
- Publication number 20230384212
- Publication date Nov 30, 2023
- Samsung Electronics Co., Ltd.
- Donghyun LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INSPECTING TIP OF ATOMIC FORCE MICROSCOPE AND METHOD OF M...
- Publication number 20230194567
- Publication date Jun 22, 2023
- Samsung Electronics Co., Ltd.
- Kwangeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD...
- Publication number 20230184691
- Publication date Jun 15, 2023
- Samsung Electronics Co., Ltd.
- Yusin YANG
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LIGHT DETECTION AND RANGING (LiDAR)-BASED INSPECTION DEVICE AND MET...
- Publication number 20230108333
- Publication date Apr 6, 2023
- Samsung Electronics Co., Ltd.
- Sungyoon RYU
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION SYSTEM INCLUDING REFERENCE SPECIMEN AND METHOD OF FORMIN...
- Publication number 20230008686
- Publication date Jan 12, 2023
- Samsung Electronics Co., Ltd.
- Sungil Choi
- G01 - MEASURING TESTING
Information Patent Application
TEST APPARATUS AND TEST METHOD THEREOF
- Publication number 20220404395
- Publication date Dec 22, 2022
- Korea Advanced Institute of Science and Technology
- Sungyoon RYU
- G01 - MEASURING TESTING
Information Patent Application
THROUGH-FOCUS IMAGE-BASED METROLOGY DEVICE, OPERATION METHOD THEREO...
- Publication number 20210396510
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Kwangsoo Kim
- G01 - MEASURING TESTING
Information Patent Application
WAFER INSPECTION DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR D...
- Publication number 20210247328
- Publication date Aug 12, 2021
- Samsung Electronics Co., Ltd.
- Kihak NAM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INSPECTION DEVICE
- Publication number 20210140899
- Publication date May 13, 2021
- Samsung Electronics Co., Ltd.
- Jangik PARK
- G01 - MEASURING TESTING

Sungyoon RYU

Person

Patents Grantslast 30 patents

Test apparatus and test method thereof

Through-focus image-based metrology device, operation method thereo...

Inspection system including reference specimen and method of formin...

Wafer inspection device and method of manufacturing semiconductor d...

Patents Applicationslast 30 patents

DEFECT DETECTION DEVICE AND DEFECT DETECTION METHOD

TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD

INSPECTION METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY...

METHOD OF INSPECTING TIP OF ATOMIC FORCE MICROSCOPE AND METHOD OF M...

WAFER INSPECTION APPARATUS USING THREE-DIMENSIONAL IMAGE AND METHOD...

LIGHT DETECTION AND RANGING (LiDAR)-BASED INSPECTION DEVICE AND MET...

INSPECTION SYSTEM INCLUDING REFERENCE SPECIMEN AND METHOD OF FORMIN...

TEST APPARATUS AND TEST METHOD THEREOF

THROUGH-FOCUS IMAGE-BASED METROLOGY DEVICE, OPERATION METHOD THEREO...

WAFER INSPECTION DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR D...

SUBSTRATE INSPECTION DEVICE