Sunil A. Patel

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer for semiconductor package assembly
- Patent number 6,618,938
- Issue date Sep 16, 2003
- LSI Logic Corporation
- Maniam Alagaratnam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-isothermal electromigration testing of microelectronic packagin...
- Patent number 6,466,038
- Issue date Oct 15, 2002
- LSI Logic Corporation
- Senol Pekin
- G01 - MEASURING TESTING
Information Patent Grant
Test fixture for flip chip ball grid array circuits
- Patent number 6,433,565
- Issue date Aug 13, 2002
- LSI Logic Corporation
- Kishor V. Desai
- G01 - MEASURING TESTING
Information Patent Grant
Interposer for semiconductor package assembly
- Patent number 6,335,491
- Issue date Jan 1, 2002
- LSI Logic Corporation
- Maniam Alagaratnam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for improving ball joints in semiconductor pac...
- Patent number 6,306,751
- Issue date Oct 23, 2001
- LSI Logic Corporation
- Sunil A. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip chip ball grid array package
- Patent number 6,266,249
- Issue date Jul 24, 2001
- LSI Logic Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die clip assembly for semiconductor package
- Patent number 6,166,434
- Issue date Dec 26, 2000
- LSI Logic Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing a semiconductor device having a stiffener...
- Patent number 6,020,221
- Issue date Feb 1, 2000
- LSI Logic Corporation
- Sengsooi Lim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader/stiffener assembly and method of assembly...
- Patent number 6,002,171
- Issue date Dec 14, 1999
- LSI Logic Corporation
- Kishor V. Desai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum assisted underfill process and apparatus for semiconductor p...
- Patent number 5,998,242
- Issue date Dec 7, 1999
- LSI Logic Corporation
- Galen C. Kirkpatrick
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader/stiffener with apertures for semiconductor...
- Patent number 5,909,057
- Issue date Jun 1, 1999
- LSI Logic Corporation
- John P. McCormick
- H01 - BASIC ELECTRIC ELEMENTS

Sunil A. Patel

Person

Patents Grantslast 30 patents

Interposer for semiconductor package assembly

Non-isothermal electromigration testing of microelectronic packagin...

Test fixture for flip chip ball grid array circuits

Interposer for semiconductor package assembly

Apparatus and method for improving ball joints in semiconductor pac...

Semiconductor flip chip ball grid array package

Die clip assembly for semiconductor package

Process for manufacturing a semiconductor device having a stiffener...

Integrated heat spreader/stiffener assembly and method of assembly...

Vacuum assisted underfill process and apparatus for semiconductor p...

Integrated heat spreader/stiffener with apertures for semiconductor...