SunMi Kim

Person

Gyangju-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,543,258
- Issue date Jan 10, 2017
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 9,293,349
- Issue date Mar 22, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and method of ma...
- Patent number 9,053,953
- Issue date Jun 9, 2015
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with underfill and methods of m...
- Patent number 8,421,201
- Issue date Apr 16, 2013
- Stats Chippac Ltd.
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 8,264,059
- Issue date Sep 11, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double-sided semiconductor device and method of forming top-side an...
- Patent number 8,137,995
- Issue date Mar 20, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming holes in substrate to in...
- Patent number 7,906,371
- Issue date Mar 15, 2011
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20160148882
- Publication date May 26, 2016
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes in Substrate to In...
- Publication number 20120292751
- Publication date Nov 22, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Device and Method of Forming Top-Side an...
- Publication number 20120153452
- Publication date Jun 21, 2012
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes In Substrate to In...
- Publication number 20110121432
- Publication date May 26, 2011
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...
- Publication number 20100320587
- Publication date Dec 23, 2010
- KyungHoon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-Sided Semiconductor Device and Method of Forming Top-Side an...
- Publication number 20100148353
- Publication date Jun 17, 2010
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Holes In Substrate to In...
- Publication number 20090294928
- Publication date Dec 3, 2009
- STATS ChipPAC, Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE
- Publication number 20080315406
- Publication date Dec 25, 2008
- Jae Han Chung
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming holes in substrate to in...

Semiconductor device and method of forming holes in substrate to in...

Integrated circuit packaging system with underfill and method of ma...

Integrated circuit packaging system with underfill and methods of m...

Semiconductor device and method of forming holes in substrate to in...

Double-sided semiconductor device and method of forming top-side an...

Semiconductor device and method of forming holes in substrate to in...

Patents Applicationslast 30 patents

Semiconductor Device and Method of Forming Holes in Substrate to In...

Semiconductor Device and Method of Forming Holes in Substrate to In...

Double-Sided Semiconductor Device and Method of Forming Top-Side an...

Semiconductor Device and Method of Forming Holes In Substrate to In...

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MA...

Double-Sided Semiconductor Device and Method of Forming Top-Side an...

Semiconductor Device and Method of Forming Holes In Substrate to In...

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH CAVITY SUBSTRATE