SunYoung Chun

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming partially-etched conduct...
- Patent number 8,932,908
- Issue date Jan 13, 2015
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with partially-etched conductive layer recesse...
- Patent number 8,502,392
- Issue date Aug 6, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packaging system with package-on-package and met...
- Patent number 8,432,028
- Issue date Apr 30, 2013
- Stats Chippac Ltd.
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming partially-etched conductive layer recessed within...
- Patent number 8,288,202
- Issue date Oct 16, 2012
- STATS ChiPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package stacking system
- Patent number 8,004,093
- Issue date Aug 23, 2011
- Stats Chippac Ltd.
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20130249090
- Publication date Sep 26, 2013
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120326303
- Publication date Dec 27, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND MET...
- Publication number 20120241936
- Publication date Sep 27, 2012
- JinGwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Partially-Etched Conduct...
- Publication number 20120126416
- Publication date May 24, 2012
- STATS ChipPAC, Ltd.
- KyuWon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM
- Publication number 20100025835
- Publication date Feb 4, 2010
- JiHoon Oh
- H01 - BASIC ELECTRIC ELEMENTS