Suraj Rengarajan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Multi-component doping of copper seed layer
- Patent number 7,749,361
- Issue date Jul 6, 2010
- Applied Materials, Inc.
- Jie Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal / metal nitride barrier layer for semiconductor device applic...
- Patent number 7,687,909
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of depositing a tantalum nitride/tantalum diffusion barrier...
- Patent number 7,253,109
- Issue date Aug 7, 2007
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Sequential sputter and reactive precleans of vias and contacts
- Patent number 7,014,887
- Issue date Mar 21, 2006
- Applied Materials, Inc.
- Barney M. Cohen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for process monitoring
- Patent number 6,936,842
- Issue date Aug 30, 2005
- Applied Materials, Inc.
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a TaN seed layer
- Patent number 6,911,124
- Issue date Jun 28, 2005
- Applied Materials, Inc.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning substrates
- Patent number 6,908,865
- Issue date Jun 21, 2005
- Applied Materials, Inc.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Precleaning process for metal plug that minimizes damage to low-&#x...
- Patent number 6,589,890
- Issue date Jul 8, 2003
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monitoring process for oxide removal
- Patent number 6,579,730
- Issue date Jun 17, 2003
- Applied Materials, Inc.
- Haojiang Li
- G01 - MEASURING TESTING
Information Patent Grant
Barrier applications for aluminum planarization
- Patent number 6,368,880
- Issue date Apr 9, 2002
- Applied Materials, Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Precleaning process for metal plug that minimizes damage to low-&#x...
- Patent number 6,346,489
- Issue date Feb 12, 2002
- Applied Materials, Inc.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode...
- Patent number 6,313,033
- Issue date Nov 6, 2001
- Applied Materials, Inc.
- Tony Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrier applications for aluminum planarization
- Patent number 6,207,558
- Issue date Mar 27, 2001
- Applied Materials, Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a diffusion barrier layer which provides an im...
- Publication number 20090053888
- Publication date Feb 26, 2009
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Application of PVD W/WN bilayer barrier to aluminum bondpad in wire...
- Publication number 20080014732
- Publication date Jan 17, 2008
- Yanping Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-component doping of copper seed layer
- Publication number 20070278089
- Publication date Dec 6, 2007
- Applied Materials, Inc.
- Jie Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metal / metal nitride barrier layer for semiconductor device applic...
- Publication number 20070241458
- Publication date Oct 18, 2007
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing low resistivity barrier layers for copper inte...
- Publication number 20050272254
- Publication date Dec 8, 2005
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a tantalum nitride / tantalum diffusion barrie...
- Publication number 20050208767
- Publication date Sep 22, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compensation of spacing between magnetron and sputter target
- Publication number 20050133361
- Publication date Jun 23, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for sputter deposition
- Publication number 20030216035
- Publication date Nov 20, 2003
- APPLIED MATERIALS, INC.
- Suraj Rengarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20030116427
- Publication date Jun 26, 2003
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of depositing a TaN seed layer
- Publication number 20030089597
- Publication date May 15, 2003
- APPLIED MATERIALS, INC.
- Xianmin Tang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for cleaning substrates
- Publication number 20030062333
- Publication date Apr 3, 2003
- APPLIED MATERIALS, INC.
- Martin Kranz
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for process monitoring
- Publication number 20030032207
- Publication date Feb 13, 2003
- Suraj Rengarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Monitoring process for oxide removal
- Publication number 20030017628
- Publication date Jan 23, 2003
- APPLIED MATERIALS, INC.
- Haojiang Li
- G01 - MEASURING TESTING
Information Patent Application
Method of obtaining low temperature alpha-ta thin films using wafer...
- Publication number 20020142589
- Publication date Oct 3, 2002
- APPLIED MATERIALS, INC.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Precleaning process for metal plug that minimizes damage to low-kap...
- Publication number 20020106908
- Publication date Aug 8, 2002
- APPLIED MATERIALS, INC.
- Barney M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Barrier applications for aluminum planarization
- Publication number 20010005629
- Publication date Jun 28, 2001
- Applied Materials Inc.
- Shri Singhvi
- H01 - BASIC ELECTRIC ELEMENTS

Suraj Rengarajan

Person

Patents Grantslast 30 patents

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Multi-component doping of copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Method of depositing a tantalum nitride/tantalum diffusion barrier...

Sequential sputter and reactive precleans of vias and contacts

Method and apparatus for process monitoring

Method of depositing a TaN seed layer

Method and apparatus for cleaning substrates

Precleaning process for metal plug that minimizes damage to low-&#x...

Monitoring process for oxide removal

Barrier applications for aluminum planarization

Precleaning process for metal plug that minimizes damage to low-&#x...

Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode...

Barrier applications for aluminum planarization

Patents Applicationslast 30 patents

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Method of depositing a diffusion barrier layer which provides an im...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Application of PVD W/WN bilayer barrier to aluminum bondpad in wire...

Multi-component doping of copper seed layer

Metal / metal nitride barrier layer for semiconductor device applic...

Method of depositing low resistivity barrier layers for copper inte...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method of depositing a tantalum nitride / tantalum diffusion barrie...

Compensation of spacing between magnetron and sputter target

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method and apparatus for sputter deposition

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method of depositing a TaN seed layer

Method and apparatus for cleaning substrates

Method and apparatus for process monitoring

Monitoring process for oxide removal

Method of obtaining low temperature alpha-ta thin films using wafer...

Precleaning process for metal plug that minimizes damage to low-kap...

Barrier applications for aluminum planarization