Surapol Sawatjeen

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Bangkok, TH

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor die attachment method using non-conductive screen pri...
- Patent number 7,927,921
- Issue date Apr 19, 2011
- Microchip Technology Incorporated
- Ekgachai Kenganantanon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
NON-CONVENTIONAL METHOD OF SILICON WAFER SAWING USING A PLURALITY O...
- Publication number 20140235033
- Publication date Aug 21, 2014
- MICROCHIP TECHNOLOGY INCORPORATED
- Matthew Bunker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Die Attachment Method Using Non-Conductive Screen Pri...
- Publication number 20100304532
- Publication date Dec 2, 2010
- MICROCHIP TECHNOLOGY INCORPORATED
- Ekgachai Kenganantanon
- H01 - BASIC ELECTRIC ELEMENTS