Suresh B. Yeruva

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Chandler, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 9,312,237
- Issue date Apr 12, 2016
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with spatially varied solder resist open...
- Patent number 8,952,532
- Issue date Feb 10, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20150108204
- Publication date Apr 23, 2015
- Intel Corporation
- Tieyu Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH SPATIALLY VARIED SOLDER RESIST OPEN...
- Publication number 20140332956
- Publication date Nov 13, 2014
- Tieyu ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Passive placement in wire-bonded microelectronics
- Publication number 20080093723
- Publication date Apr 24, 2008
- Todd B. Myers
- H01 - BASIC ELECTRIC ELEMENTS