Suresh Belani

Person

Los Altos, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 10,229,893
- Issue date Mar 12, 2019
- Vishay-Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 9,595,503
- Issue date Mar 14, 2017
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Common drain power clip for battery pack protection mosfet
- Patent number 9,379,045
- Issue date Jun 28, 2016
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 9,184,152
- Issue date Nov 10, 2015
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual lead frame semiconductor package and method of manufacture
- Patent number 8,822,273
- Issue date Sep 2, 2014
- Vishay Siliconix
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module power clip
- Patent number 8,723,300
- Issue date May 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages including die and L-shaped lead and method o...
- Patent number 8,586,419
- Issue date Nov 19, 2013
- Vishay Siliconix
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20170271304
- Publication date Sep 21, 2017
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140370661
- Publication date Dec 18, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20140332939
- Publication date Nov 13, 2014
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET
- Publication number 20140070392
- Publication date Mar 13, 2014
- Fairchild Semiconductor Corporation
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE POWER CLIP
- Publication number 20140042599
- Publication date Feb 13, 2014
- Chung-Lin Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual Lead Frame Semiconductor Package and Method of Manufacture
- Publication number 20120112331
- Publication date May 10, 2012
- SILICONIX ELECTRONIC CO., LTD.
- Frank Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages Including Die and L-Shaped Lead and Method o...
- Publication number 20110175217
- Publication date Jul 21, 2011
- VISHAY-SILICONIX
- Serge Jaunay
- H01 - BASIC ELECTRIC ELEMENTS

Suresh Belani

Person

Patents Grantslast 30 patents

Dual lead frame semiconductor package and method of manufacture

Dual lead frame semiconductor package and method of manufacture

Common drain power clip for battery pack protection mosfet

Dual lead frame semiconductor package and method of manufacture

Dual lead frame semiconductor package and method of manufacture

Multi-chip module power clip

Semiconductor packages including die and L-shaped lead and method o...

Patents Applicationslast 30 patents

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

Dual Lead Frame Semiconductor Package and Method of Manufacture

COMMON DRAIN POWER CLIP FOR BATTERY PACK PROTECTION MOSFET

MULTI-CHIP MODULE POWER CLIP

Dual Lead Frame Semiconductor Package and Method of Manufacture

Semiconductor Packages Including Die and L-Shaped Lead and Method o...