Suresh D. Kadakia

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 9,087,834
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,587,114
- Issue date Nov 19, 2013
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multichip electronic packages and methods of manufacture
- Patent number 8,445,331
- Issue date May 21, 2013
- International Business Machines Corporation
- Suresh D. Kadakia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for implementing secure multichip modules for encryption...
- Patent number 7,806,341
- Issue date Oct 5, 2010
- International Business Machines Corporation
- Mukta G. Farooq
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,472,836
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and structure for implementing secure multichip modules for...
- Patent number 7,281,667
- Issue date Oct 16, 2007
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Process for the manufacture of multilayer ceramic substrates
- Patent number 6,676,784
- Issue date Jan 13, 2004
- International Business Machines Corporation
- Christopher D. Setzer
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate design of a chip using a generic substrate design
- Patent number 6,528,735
- Issue date Mar 4, 2003
- International Business Machines Corporation
- Harsaran S. Bhatia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of protecting a non-planar feature using compressive pads an...
- Patent number 6,179,951
- Issue date Jan 30, 2001
- International Business Machines Corporation
- Govindarajan Natarajan
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electronic component package with decoupling capacitors completely...
- Patent number 5,831,810
- Issue date Nov 3, 1998
- International Business Machines Corporation
- Kenneth A. Bird
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct distribution repair and engineering change system
- Patent number 5,243,140
- Issue date Sep 7, 1993
- International Business Machines Corporation
- Harsaran S. Bhatia
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20140051211
- Publication date Feb 20, 2014
- International Business Machines Corporation
- Suresh D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120196408
- Publication date Aug 2, 2012
- International Business Machines Corporation
- SURESH D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE
- Publication number 20120080784
- Publication date Apr 5, 2012
- International Business Machines Corporation
- SURESH D. KADAKIA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...
- Publication number 20090145973
- Publication date Jun 11, 2009
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20080000988
- Publication date Jan 3, 2008
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...
- Publication number 20060231633
- Publication date Oct 19, 2006
- International Business Machines Corporation
- Mukta G. Farooq
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SUBSTRATE DESIGN OF A CHIP USING A GENERIC SUBSTRATE DESIGN
- Publication number 20030047352
- Publication date Mar 13, 2003
- International Business Machines Corporation
- Harsaran S. Bhatia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for the manufacture of multilayer ceramic substrates
- Publication number 20030015277
- Publication date Jan 23, 2003
- International Business Machines Corporation
- Christopher D. Setzer
- B32 - LAYERED PRODUCTS

Suresh D. Kadakia

Person

Patents Grantslast 30 patents

Multichip electronic packages and methods of manufacture

Multichip electronic packages and methods of manufacture

Multichip electronic packages and methods of manufacture

Structure for implementing secure multichip modules for encryption...

Method and structure for implementing secure multichip modules for...

Method and structure for implementing secure multichip modules for...

Process for the manufacture of multilayer ceramic substrates

Substrate design of a chip using a generic substrate design

Method of protecting a non-planar feature using compressive pads an...

Electronic component package with decoupling capacitors completely...

Direct distribution repair and engineering change system

Patents Applicationslast 30 patents

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

MULTICHIP ELECTRONIC PACKAGES AND METHODS OF MANUFACTURE

STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR ENCRYPTION...

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

METHOD AND STRUCTURE FOR IMPLEMENTING SECURE MULTICHIP MODULES FOR...

SUBSTRATE DESIGN OF A CHIP USING A GENERIC SUBSTRATE DESIGN

Process for the manufacture of multilayer ceramic substrates