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Suresh Pothukuchi
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
Patent number
11,830,863
Issue date
Nov 28, 2023
Intel Corporation
Suresh V. Pothukuchi
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
Patent number
11,217,573
Issue date
Jan 4, 2022
Intel Corporation
Suresh V. Pothukuchi
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
Patent number
9,406,618
Issue date
Aug 2, 2016
Intel Corporation
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Die-stacking using through-silicon vias on bumpless build-up layer...
Patent number
8,786,066
Issue date
Jul 22, 2014
Intel Corporation
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
FPGA BASED PLATFORM FOR POST-SILICON VALIDATION OF CHIPLETS
Publication number
20230401130
Publication date
Dec 14, 2023
Intel Corporation
Rakesh Mehta
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
OPTICAL MULTICHIP PACKAGE WITH MULTIPLE SYSTEM-ON-CHIP DIES
Publication number
20220199600
Publication date
Jun 23, 2022
Intel Corporation
Zhichao ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH BANDWIDTH OPTICAL INTERCONNECTION ARCHITECTURES
Publication number
20220155539
Publication date
May 19, 2022
Intel Corporation
Srinivas V. PIETAMBARAM
G02 - OPTICS
Information
Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
Publication number
20220085001
Publication date
Mar 17, 2022
Intel Corporation
Suresh V. POTHUKUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
Publication number
20210280566
Publication date
Sep 9, 2021
Intel Corporation
Suresh V. POTHUKUCHI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
Publication number
20210210478
Publication date
Jul 8, 2021
Intel Corporation
Susheel JADHAV
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
Publication number
20140327149
Publication date
Nov 6, 2014
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
Publication number
20140295621
Publication date
Oct 2, 2014
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIE-STACKING USING THROUGH-SILICON VIAS ON BUMPLESS BUILD-UP LAYER...
Publication number
20120074581
Publication date
Mar 29, 2012
John S. Guzek
H01 - BASIC ELECTRIC ELEMENTS