Suresh Upadhyayula

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing microelectronic devices, related tools and...
- Patent number 11,282,746
- Issue date Mar 22, 2022
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical semiconductor device having a stacked die block
- Patent number 10,325,881
- Issue date Jun 18, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including support pillars on solder mask
- Patent number 10,177,128
- Issue date Jan 8, 2019
- SanDisk Technologies LLC
- Chih Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including independent film layer for embedding...
- Patent number 9,773,766
- Issue date Sep 26, 2017
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overheat prevention for annealing non-volatile memory
- Patent number 9,761,290
- Issue date Sep 12, 2017
- SanDisk Technologies LLC
- Navneeth Kankani
- G11 - INFORMATION STORAGE
Information Patent Grant
Low profile wire bonded USB device
- Patent number 9,218,953
- Issue date Dec 22, 2015
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package including flip chip controller at bottom of d...
- Patent number 8,987,053
- Issue date Mar 24, 2015
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector of a universal serial bus device
- Patent number 8,986,050
- Issue date Mar 24, 2015
- SanDisk Technologies Inc.
- Anthony King
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Low profile wire bonded USB device
- Patent number 8,947,883
- Issue date Feb 3, 2015
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Etched surface mount islands in a leadframe package
- Patent number 8,659,133
- Issue date Feb 25, 2014
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component including micro balls
- Patent number 8,637,779
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Radiation-shielded semiconductor device
- Patent number 8,637,963
- Issue date Jan 28, 2014
- SanDisk Technologies Inc.
- Suresh Kumar Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Col-based semiconductor package including electrical connections th...
- Patent number 8,575,739
- Issue date Nov 5, 2013
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including flip chip controller at bottom of d...
- Patent number 8,373,268
- Issue date Feb 12, 2013
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor devices with LEDS
- Patent number 8,022,417
- Issue date Sep 20, 2011
- SanDisk Technologies Inc.
- Hem Takiar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Etched surface mount islands in a leadframe package
- Patent number 8,008,132
- Issue date Aug 30, 2011
- SanDisk Technologies Inc.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package including flip chip controller at bottom of d...
- Patent number 7,867,819
- Issue date Jan 11, 2011
- SanDisk Corporation
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of assembling semiconductor devices with LEDS
- Patent number 7,812,356
- Issue date Oct 12, 2010
- SanDisk Corporation
- Hem Takiar
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of assembling semiconductor devices with LEDs
- Patent number 7,384,817
- Issue date Jun 10, 2008
- SanDisk Corporation
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical connector with grounding pin
- Patent number 7,354,314
- Issue date Apr 8, 2008
- SanDisk Corporation
- Steven Sprouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portable memory storage device
- Patent number D524817
- Issue date Jul 11, 2006
- SanDisk Corporation
- Kevin M. Conley
- D14 - Recording, communication, or information retrieval equipment

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED TOOLS AND...
- Publication number 20210202316
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Suresh K. Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL SEMICONDUCTOR DEVICE
- Publication number 20180047706
- Publication date Feb 15, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SUPPORT PILLARS ON SOLDER MASK
- Publication number 20160293560
- Publication date Oct 6, 2016
- SANDISK TECHNOLOGIES INC.
- Chih Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...
- Publication number 20150221624
- Publication date Aug 6, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Ning Ye
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE
- Publication number 20150187745
- Publication date Jul 2, 2015
- Sandisk Semiconductor (Shanghai) Co., Ltd.
- Chin-Tien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE WIRE BONDED USB DEVICE
- Publication number 20150155156
- Publication date Jun 4, 2015
- SANDISK TECHNOLOGIES INC.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR OF A UNIVERSAL SERIAL BUS DEVICE
- Publication number 20140273558
- Publication date Sep 18, 2014
- SANDISK TECHNOLOGIES INC.
- ANTHONY KING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...
- Publication number 20130157413
- Publication date Jun 20, 2013
- SANDISK TECHNOLOGIES INC.
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIATION-SHIELDED SEMICONDUCTOR DEVICE
- Publication number 20130087895
- Publication date Apr 11, 2013
- Suresh Kumar Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
- Publication number 20130015589
- Publication date Jan 17, 2013
- Chih-Chin Liao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT INCLUDING MICRO BALLS
- Publication number 20120305305
- Publication date Dec 6, 2012
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COL-BASED SEMICONDUCTOR PACKAGE INCLUDING ELECTRICAL CONNECTIONS TH...
- Publication number 20120280378
- Publication date Nov 8, 2012
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED SURFACE MOUNT ISLANDS IN A LEADFRAME PACKAGE
- Publication number 20110309485
- Publication date Dec 22, 2011
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...
- Publication number 20110095440
- Publication date Apr 28, 2011
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES WITH LEDS
- Publication number 20110024897
- Publication date Feb 3, 2011
- SANDISK CORPORATION
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED SURFACE MOUNT ISLANDS IN A LEADFRAME PACKAGE
- Publication number 20090166828
- Publication date Jul 2, 2009
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW PROFILE WIRE BONDED USB DEVICE
- Publication number 20090165294
- Publication date Jul 2, 2009
- Suresh Upadhyayula
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...
- Publication number 20090166887
- Publication date Jul 2, 2009
- Suresh Upadhyayula
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES WITH LEDS
- Publication number 20080198031
- Publication date Aug 21, 2008
- SANDISK CORPORATION
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of assembling semiconductor devices with LEDs
- Publication number 20060270105
- Publication date Nov 30, 2006
- Hem Takiar
- H01 - BASIC ELECTRIC ELEMENTS

Suresh Upadhyayula

Person

Patents Grantslast 30 patents

Method of manufacturing microelectronic devices, related tools and...

Vertical semiconductor device having a stacked die block

Semiconductor device including support pillars on solder mask

Semiconductor device including independent film layer for embedding...

Overheat prevention for annealing non-volatile memory

Low profile wire bonded USB device

Semiconductor package including flip chip controller at bottom of d...

Connector of a universal serial bus device

Low profile wire bonded USB device

Etched surface mount islands in a leadframe package

Electronic component including micro balls

Radiation-shielded semiconductor device

Col-based semiconductor package including electrical connections th...

Semiconductor package including flip chip controller at bottom of d...

Method of assembling semiconductor devices with LEDS

Etched surface mount islands in a leadframe package

Semiconductor package including flip chip controller at bottom of d...

Method of assembling semiconductor devices with LEDS

Method of assembling semiconductor devices with LEDs

Electrical connector with grounding pin

Portable memory storage device

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING MICROELECTRONIC DEVICES, RELATED TOOLS AND...

VERTICAL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE INCLUDING SUPPORT PILLARS ON SOLDER MASK

SEMICONDUCTOR DEVICE INCLUDING INDEPENDENT FILM LAYER FOR EMBEDDING...

SOLDER PILLARS FOR EMBEDDING SEMICONDUCTOR DIE

LOW PROFILE WIRE BONDED USB DEVICE

CONNECTOR OF A UNIVERSAL SERIAL BUS DEVICE

SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...

RADIATION-SHIELDED SEMICONDUCTOR DEVICE

CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS

ELECTRONIC COMPONENT INCLUDING MICRO BALLS

COL-BASED SEMICONDUCTOR PACKAGE INCLUDING ELECTRICAL CONNECTIONS TH...

ETCHED SURFACE MOUNT ISLANDS IN A LEADFRAME PACKAGE

SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES WITH LEDS

ETCHED SURFACE MOUNT ISLANDS IN A LEADFRAME PACKAGE

LOW PROFILE WIRE BONDED USB DEVICE

SEMICONDUCTOR PACKAGE INCLUDING FLIP CHIP CONTROLLER AT BOTTOM OF D...

METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES WITH LEDS

Method of assembling semiconductor devices with LEDs