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Suriyakala Ramalingam
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Coupling a magnet with a MEMS device
Patent number
11,022,792
Issue date
Jun 1, 2021
Intel Corporation
Kyle Yazzie
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Apparatus and method for conformal coating of integrated circuit pa...
Patent number
10,356,912
Issue date
Jul 16, 2019
Intel Corporation
Priyanka Dobriyal
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Compartment for magnet placement
Patent number
10,317,952
Issue date
Jun 11, 2019
Intel Corporation
Sandeep S. Iyer
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method for forming an electrical device and electrical devices
Patent number
10,269,695
Issue date
Apr 23, 2019
Intel Corporation
Robert F Cheney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
Patent number
10,115,606
Issue date
Oct 30, 2018
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mold compound with reinforced fibers
Patent number
9,704,767
Issue date
Jul 11, 2017
Intel Corporation
Suriyakala Ramalingam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming an electrical device and electrical devices
Patent number
9,691,675
Issue date
Jun 27, 2017
Intel Corporation
Robert F Cheney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
Patent number
9,640,415
Issue date
May 2, 2017
Intel Corporation
Randall D. Lowe
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for reducing underfill filler settling in integrated circuit...
Patent number
9,431,274
Issue date
Aug 30, 2016
Intel Corporation
Suriyakala Ramalingam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods of promoting adhesion between underfill and conductive bump...
Patent number
9,330,993
Issue date
May 3, 2016
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Robust ink formulations for durable markings on microelectronic pac...
Patent number
8,900,919
Issue date
Dec 2, 2014
Intel Corporation
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Grant
Techniques and configurations for surface treatment of an integrate...
Patent number
8,895,365
Issue date
Nov 25, 2014
Intel Corporation
Suriyakala Ramalingam
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
BARRIER ENABLED CUF AND MOLD PROCESS FOR MULTI-CHIP PACKAGING
Publication number
20240153837
Publication date
May 9, 2024
Intel Corporation
Ziyin LIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COUPLING A MAGNET WITH A MEMS DEVICE
Publication number
20190391386
Publication date
Dec 26, 2019
Intel Corporation
Kyle Yazzie
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
Publication number
20180342463
Publication date
Nov 29, 2018
Intel Corporation
Taylor GAINES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
NO-FLOW ADHESIVE FOR SECOND AND THIRD LEVEL INTERCONNECTS
Publication number
20180324955
Publication date
Nov 8, 2018
Intel Corporation
Mohit SOOD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONDUCTIVE ADHESIVE LAYER FOR SEMICONDUCTOR DEVICES AND PACKAGES
Publication number
20180190593
Publication date
Jul 5, 2018
Intel Corporation
Taylor GAINES
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMPARTMENT FOR MAGNET PLACEMENT
Publication number
20180095503
Publication date
Apr 5, 2018
Intel Corporation
Sandeep S. IYER
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
CONFORMAL COATING OF INTEGRATED CIRCUIT PACKAGES
Publication number
20180070456
Publication date
Mar 8, 2018
Intel Corporation
Priyanka Dobriyal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REMOVABLE IC PACKAGE STIFFENER
Publication number
20170287799
Publication date
Oct 5, 2017
Steven A. Klein
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING AN ELECTRICAL DEVICE AND ELECTRICAL DEVICES
Publication number
20170263517
Publication date
Sep 14, 2017
Intel Corporation
Robert F Cheney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Mold compound with reinforced fibers
Publication number
20170186658
Publication date
Jun 29, 2017
Intel Corporation
Suriyakala RAMALINGAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING AN ELECTRICAL DEVICE AND ELECTRICAL DEVICES
Publication number
20170178988
Publication date
Jun 22, 2017
Intel Corporation
Robert F Cheney
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
Publication number
20160343591
Publication date
Nov 24, 2016
Intel Corporation
Suriyakala Ramalingam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
On Package Floating Metal/Stiffener Grounding to Mitigate RFI and S...
Publication number
20160268213
Publication date
Sep 15, 2016
Intel Corporation
Hongjin JIANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
Publication number
20160240395
Publication date
Aug 18, 2016
Intel Corporation
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
Publication number
20150166804
Publication date
Jun 18, 2015
Intel Corporation
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
ROBUST INK FORMULATIONS FOR DURABLE MARKINGS ON MICROELECTRONIC PAC...
Publication number
20140264957
Publication date
Sep 18, 2014
Randall D. Lowe
C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information
Patent Application
REDUCTION OF UNDERFILL FILLER SETTLING IN INTEGRATED CIRCUIT PACKAGES
Publication number
20140177149
Publication date
Jun 26, 2014
Suriyakala Ramalingam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS OF PROMOTING ADHESION BETWEEN UNDERFILL AND CONDUCTIVE BUMP...
Publication number
20140175634
Publication date
Jun 26, 2014
Yiqun Bai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNIQUES AND CONFIGURATIONS FOR SURFACE TREATMENT OF AN INTEGRATE...
Publication number
20140061902
Publication date
Mar 6, 2014
Suriyakala Ramalingam
H01 - BASIC ELECTRIC ELEMENTS