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Susan J. Swindlehurst
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Redwood City, CA, US
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Patents Grants
last 30 patents
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Patent Grant
Method and structure for uniform height solder bumps on a semicondu...
Patent number
6,268,656
Issue date
Jul 31, 2001
Agilent Technologies, Inc.
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
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Patent Grant
Method and structure for uniform height solder bumps on a semicondu...
Patent number
6,146,984
Issue date
Nov 14, 2000
Agilent Technologies Inc.
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Solder retention ring for improved solder bump formation
Patent number
6,085,968
Issue date
Jul 11, 2000
Hewlett-Packard Company
Susan J. Swindlehurst
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
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Patent Grant
Redistribution layer and under bump material structure for converti...
Patent number
6,011,314
Issue date
Jan 4, 2000
Hewlett-Packard Company
Jacques Leibovitz
H01 - BASIC ELECTRIC ELEMENTS