Susan Williams

Person

Balmain, AU

People

Patents Grantslast 30 patents

Information Patent Grant
Printhead assembly with minimal leakage
- Patent number 8,444,252
- Issue date May 21, 2013
- Zamtec Ltd
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Double laser drilling of a printhead integrated circuit attachment...
- Patent number 8,293,057
- Issue date Oct 23, 2012
- Zamtec Limited
- Nagesh Ramachandra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printhead assembly with molded ink manifold having polymer coating
- Patent number 8,132,893
- Issue date Mar 13, 2012
- Silverbrook Research Pty Ltd
- Seung Jin Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Electronic component with wire bonds in low modulus fill encapsulant
- Patent number 8,063,318
- Issue date Nov 22, 2011
- Silverbrook Research Pty Ltd
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded ink manifold with polymer coating
- Patent number 8,011,755
- Issue date Sep 6, 2011
- Silverbrook Research Pty Ltd
- Seung Jin Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of fabricating printhead assembly
- Patent number 7,935,204
- Issue date May 3, 2011
- Silverbrook Research Pty Ltd
- Seung Jin Lee
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of assembling pagewidth printhead
- Patent number 7,875,139
- Issue date Jan 25, 2011
- Silverbrook Research Pty Ltd
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead integrated circuit attachment film having differentiated...
- Patent number 7,845,755
- Issue date Dec 7, 2010
- Silverbrook Research Pty Ltd
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Printhead assembly with minimal leakage
- Patent number 7,845,763
- Issue date Dec 7, 2010
- Silverbrook Research Pty Ltd
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of attaching printhead integrated circuits to an ink manifol...
- Patent number 7,727,348
- Issue date Jun 1, 2010
- Silverbrook Research Pty Ltd
- Sarkis Minas Keshishian
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS
- Publication number 20120048185
- Publication date Mar 1, 2012
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTHEAD ASSEMBLY WITH MOLDED INK MANIFOLD HAVING POLYMER COATING
- Publication number 20110304672
- Publication date Dec 15, 2011
- SILVERBROOK RESEARCH PTY LTD
- Seung Jin Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE
- Publication number 20110085010
- Publication date Apr 14, 2011
- SILVERBROOK RESEARCH PTY LTD
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF ASSEMBLING PAGEWIDTH PRINTHEAD
- Publication number 20100224319
- Publication date Sep 9, 2010
- SILVERBROOK RESEARCH PTY LTD
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF FABRICATING PRINTHEAD ASSEMBLY
- Publication number 20100147445
- Publication date Jun 17, 2010
- SILVERBROOK RESEARCH PTY LTD
- Seung Jin Lee
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLDED INK MANIFOLD WITH POLYMER COATING
- Publication number 20100149257
- Publication date Jun 17, 2010
- SILVERBROOK RESEARCH PTY LTD
- Seung Jin Lee
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
DOUBLE LASER DRILLING OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT...
- Publication number 20090231383
- Publication date Sep 17, 2009
- SILVERBROOK RESEARCH PTY LTD
- Nagesh Ramachandra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE
- Publication number 20090231400
- Publication date Sep 17, 2009
- SILVERBROOK RESEARCH PTY LTD
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
METHOD OF ATTACHING PRINTHEAD INTEGRATED CIRCUITS TO AN INK MANIFOL...
- Publication number 20090229744
- Publication date Sep 17, 2009
- SILVERBROOK RESEARCH PTY LTD
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM HAVING DIFFERENTIATED...
- Publication number 20090231384
- Publication date Sep 17, 2009
- SILVERBROOK RESEARCH PTY LTD
- Sarkis Minas Keshishian
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090135569
- Publication date May 28, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT
- Publication number 20090079097
- Publication date Mar 26, 2009
- SILVERBROOK RESEARCH PTY LTD
- Susan Williams
- H01 - BASIC ELECTRIC ELEMENTS

Susan Williams

Person

Patents Grantslast 30 patents

Printhead assembly with minimal leakage

Double laser drilling of a printhead integrated circuit attachment...

Printhead assembly with molded ink manifold having polymer coating

Electronic component with wire bonds in low modulus fill encapsulant

Molded ink manifold with polymer coating

Method of fabricating printhead assembly

Method of assembling pagewidth printhead

Printhead integrated circuit attachment film having differentiated...

Printhead assembly with minimal leakage

Method of attaching printhead integrated circuits to an ink manifol...

Patents Applicationslast 30 patents

APPARATUS FOR FORMING ASYMMETRICAL ENCAPSULANT BEADS ON WIRE BONDS

PRINTHEAD ASSEMBLY WITH MOLDED INK MANIFOLD HAVING POLYMER COATING

PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE

METHOD OF ASSEMBLING PAGEWIDTH PRINTHEAD

METHOD OF FABRICATING PRINTHEAD ASSEMBLY

MOLDED INK MANIFOLD WITH POLYMER COATING

DOUBLE LASER DRILLING OF A PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT...

PRINTHEAD ASSEMBLY WITH MINIMAL LEAKAGE

METHOD OF ATTACHING PRINTHEAD INTEGRATED CIRCUITS TO AN INK MANIFOL...

PRINTHEAD INTEGRATED CIRCUIT ATTACHMENT FILM HAVING DIFFERENTIATED...

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT

ELECTRONIC COMPONENT WITH WIRE BONDS IN LOW MODULUS FILL ENCAPSULANT