Sushrutha GUJJULA

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat dissipation structures for optical communication devices
- Patent number 12,366,713
- Issue date Jul 22, 2025
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,830,863
- Issue date Nov 28, 2023
- Intel Corporation
- Suresh V. Pothukuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,776,821
- Issue date Oct 3, 2023
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Micro-electronic package with substrate protrusion to facilitate di...
- Patent number 11,282,717
- Issue date Mar 22, 2022
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-sided co-packaged optics for high bandwidth networking applica...
- Patent number 11,217,573
- Issue date Jan 4, 2022
- Intel Corporation
- Suresh V. Pothukuchi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE
- Publication number 20220413236
- Publication date Dec 29, 2022
- Intel Corporation
- Omkar KARHADE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS
- Publication number 20220404474
- Publication date Dec 22, 2022
- Intel Corporation
- Eleanor Patricia Paras Rabadam
- G02 - OPTICS
Information Patent Application
HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES
- Publication number 20220397726
- Publication date Dec 15, 2022
- Intel Corporation
- Omkar Karhade
- G02 - OPTICS
Information Patent Application
ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE
- Publication number 20220390562
- Publication date Dec 8, 2022
- Guiyun Bai
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20220165585
- Publication date May 26, 2022
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20220085001
- Publication date Mar 17, 2022
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...
- Publication number 20210280566
- Publication date Sep 9, 2021
- Intel Corporation
- Suresh V. POTHUKUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
- Publication number 20210210478
- Publication date Jul 8, 2021
- Intel Corporation
- Susheel JADHAV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...
- Publication number 20190304808
- Publication date Oct 3, 2019
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS

Sushrutha GUJJULA

Person

Patents Grantslast 30 patents

Heat dissipation structures for optical communication devices

Dual-sided co-packaged optics for high bandwidth networking applica...

Micro-electronic package with substrate protrusion to facilitate di...

Micro-electronic package with substrate protrusion to facilitate di...

Dual-sided co-packaged optics for high bandwidth networking applica...

Patents Applicationslast 30 patents

PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE

SILICON PHOTONIC SYSTEMS FOR LIDAR APPLICATIONS

HEAT DISSIPATION STRUCTURES FOR OPTICAL COMMUNICATION DEVICES

ELECTRICAL AND PHOTONIC INTEGRATED CIRCUITS ARCHITECTURE

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICA...

PACKAGING SOLUTIONS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS

MICRO-ELECTRONIC PACKAGE WITH SUBSTRATE PROTRUSION TO FACILITATE DI...