Sushumna Iruvanti

Person

Wappingers Falls, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi chip hardware security module
- Patent number 11,882,645
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 11,569,181
- Issue date Jan 31, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated stiffener to control the warpage of electronic chip carriers
- Patent number 11,302,651
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid TIMs for electronic package cooling
- Patent number 11,264,306
- Issue date Mar 1, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal integrated circuit (IC) device package lid
- Patent number 11,158,562
- Issue date Oct 26, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Localized catalyst for enhanced thermal interface material heat tra...
- Patent number 11,152,282
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Charles Leon Arvin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mitigating moisture-driven degradation of features designed to prev...
- Patent number 10,892,233
- Issue date Jan 12, 2021
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous thermal interface material for corner and or edge deg...
- Patent number 10,804,181
- Issue date Oct 13, 2020
- International Business Machines Corporation
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an electronic package
- Patent number 10,636,746
- Issue date Apr 28, 2020
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of laminate failure in integrated circuit (IC) device car...
- Patent number 10,607,928
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,593,564
- Issue date Mar 17, 2020
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,381,276
- Issue date Aug 13, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,332,813
- Issue date Jun 25, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test cell for laminate and method
- Patent number 10,249,548
- Issue date Apr 2, 2019
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,083,886
- Issue date Sep 25, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 10,049,896
- Issue date Aug 14, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid attach optimization to limit electronic package warpage
- Patent number 9,947,603
- Issue date Apr 17, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductance thermal interface materials based on nanos...
- Patent number 9,512,291
- Issue date Dec 6, 2016
- International Business Machines Corporation
- Theodorian Borca-Tasciuc
- B82 - NANO-TECHNOLOGY
Information Patent Grant
High thermal conductance thermal interface materials based on nanos...
- Patent number 9,045,674
- Issue date Jun 2, 2015
- International Business Machines Corporation
- Sushumna Iruvanti
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,531,025
- Issue date Sep 10, 2013
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and package for circuit chip packaging
- Patent number 8,455,998
- Issue date Jun 4, 2013
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reliability enhancement of metal thermal interface
- Patent number 8,232,636
- Issue date Jul 31, 2012
- International Business Machines Corporation
- James N Humenik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metal thermal interface
- Patent number 8,156,998
- Issue date Apr 17, 2012
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Method and package for circuit chip packaging
- Patent number 8,053,284
- Issue date Nov 8, 2011
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal paste containment for semiconductor modules
- Patent number 8,021,925
- Issue date Sep 20, 2011
- International Business Machines Corporation
- David L. Edwards
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Reversible thermal thickening grease
- Patent number 7,981,849
- Issue date Jul 19, 2011
- International Business Machines Corporation
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Enhanced thermo-oxidative stability thermal interface compositions...
- Patent number 7,964,542
- Issue date Jun 21, 2011
- International Business Machines Corporation
- Krishna G. Sachdev
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...
Information Patent Grant
Low compressive force, non-silicone, high thermal conducting formul...
- Patent number 7,816,785
- Issue date Oct 19, 2010
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal pillow
- Patent number 7,709,951
- Issue date May 4, 2010
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterned metal thermal interface
- Patent number 7,694,719
- Issue date Apr 13, 2010
- International Business Machines Corporation
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...
- Publication number 20250098062
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Philipp K. BUCHLING REGO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REWORKABLE POLYSILOXANES FOR THERMAL INTERFACE MATERIALS
- Publication number 20240409692
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Teddie P. Magbitang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
REWORKABLE POLYSILOXANES FOR THERMAL INTERFACE MATERIALS
- Publication number 20240409695
- Publication date Dec 12, 2024
- International Business Machines Corporation
- Teddie P. Magbitang
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES
- Publication number 20230418009
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Yuanchen Hu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MULTI CHIP HARDWARE SECURITY MODULE
- Publication number 20230130104
- Publication date Apr 27, 2023
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conformal Integrated Circuit (IC) Device Package Lid
- Publication number 20210249333
- Publication date Aug 12, 2021
- International Business Machines Corporation
- David J. Lewison
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20210118819
- Publication date Apr 22, 2021
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING
- Publication number 20210098334
- Publication date Apr 1, 2021
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heterogeneous Thermal Interface Material for Corner and or Edge Deg...
- Publication number 20200294880
- Publication date Sep 17, 2020
- Marcus E. Interrante
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...
- Publication number 20200135662
- Publication date Apr 30, 2020
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20200013732
- Publication date Jan 9, 2020
- International Business Machines Corporation
- Kamal K. SIKKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS
- Publication number 20190267332
- Publication date Aug 29, 2019
- International Business Machines Corporation
- Kamal K. SIKKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180233381
- Publication date Aug 16, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20180076101
- Publication date Mar 15, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068916
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20180068917
- Publication date Mar 8, 2018
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST CELL FOR LAMINATE AND METHOD
- Publication number 20170178982
- Publication date Jun 22, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20170170030
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE
- Publication number 20170170086
- Publication date Jun 15, 2017
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOS...
- Publication number 20150247019
- Publication date Sep 3, 2015
- Rensselaer Polytechnic Institute
- Theodorian Borca-Tasciuc
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOS...
- Publication number 20120187332
- Publication date Jul 26, 2012
- Rensselaer Polytechnic Institute
- Sushumna Iruvanti
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
- Publication number 20120018873
- Publication date Jan 26, 2012
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE
- Publication number 20110180923
- Publication date Jul 28, 2011
- International Business Machines Corporation
- JAMES N. HUMENIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING
- Publication number 20110037167
- Publication date Feb 17, 2011
- International Business Machines Corporation
- Sushumna Iruvanti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMUL...
- Publication number 20100181663
- Publication date Jul 22, 2010
- International Business Machines Corporation
- SUSHUMNA IRUVANTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNED METAL THERMAL INTERFACE
- Publication number 20100147497
- Publication date Jun 17, 2010
- Bruce K. Furman
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Chip Cooling System with Convex Portion
- Publication number 20090109628
- Publication date Apr 30, 2009
- International Business Machines Corporation
- Raschid J. Bezama
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES
- Publication number 20080299707
- Publication date Dec 4, 2008
- International Business Machines Corporation
- David L. Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL PILLOW
- Publication number 20080225484
- Publication date Sep 18, 2008
- International Business Machines Corporation
- William L. Brodsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REVERSIBLE THERMAL THICKENING GREASE
- Publication number 20080220998
- Publication date Sep 11, 2008
- IBM CORPORATION (YORKTOWN)
- Claudius Feger
- C10 - PETROLEUM, GAS OR COKE INDUSTRIES TECHNICAL GASES CONTAINING CARBON MON...

Sushumna Iruvanti

Person

Patents Grantslast 30 patents

Multi chip hardware security module

Mitigating moisture-driven degradation of features designed to prev...

Laminated stiffener to control the warpage of electronic chip carriers

Hybrid TIMs for electronic package cooling

Conformal integrated circuit (IC) device package lid

Localized catalyst for enhanced thermal interface material heat tra...

Mitigating moisture-driven degradation of features designed to prev...

Heterogeneous thermal interface material for corner and or edge deg...

Method of forming an electronic package

Reduction of laminate failure in integrated circuit (IC) device car...

Lid attach optimization to limit electronic package warpage

Test cell for laminate and method

Lid attach optimization to limit electronic package warpage

Test cell for laminate and method

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

Lid attach optimization to limit electronic package warpage

High thermal conductance thermal interface materials based on nanos...

High thermal conductance thermal interface materials based on nanos...

Thermal paste containment for semiconductor modules

Method and package for circuit chip packaging

Reliability enhancement of metal thermal interface

Patterned metal thermal interface

Method and package for circuit chip packaging

Thermal paste containment for semiconductor modules

Reversible thermal thickening grease

Enhanced thermo-oxidative stability thermal interface compositions...

Low compressive force, non-silicone, high thermal conducting formul...

Thermal pillow

Patterned metal thermal interface

Patents Applicationslast 30 patents

TAMPER-DETECT ASSEMBLIES INCLUDING HEAT SINK COVERS WITH INTEGRATED...

REWORKABLE POLYSILOXANES FOR THERMAL INTERFACE MATERIALS

REWORKABLE POLYSILOXANES FOR THERMAL INTERFACE MATERIALS

THERMAL MANAGEMENT OF COMPUTER HARDWARE MODULES

MULTI CHIP HARDWARE SECURITY MODULE

Conformal Integrated Circuit (IC) Device Package Lid

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

HYBRID TIMs FOR ELECTRONIC PACKAGE COOLING

Heterogeneous Thermal Interface Material for Corner and or Edge Deg...

MITIGATING MOISTURE-DRIVEN DEGRADATION OF FEATURES DESIGNED TO PREV...

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

LAMINATED STIFFENER TO CONTROL THE WARPAGE OF ELECTRONIC CHIP CARRIERS

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

TEST CELL FOR LAMINATE AND METHOD

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

TEST CELL FOR LAMINATE AND METHOD

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

LID ATTACH OPTIMIZATION TO LIMIT ELECTRONIC PACKAGE WARPAGE

HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOS...

HIGH THERMAL CONDUCTANCE THERMAL INTERFACE MATERIALS BASED ON NANOS...

METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING

RELIABILITY ENHANCEMENT OF METAL THERMAL INTERFACE

METHOD AND PACKAGE FOR CIRCUIT CHIP PACKAGING

LOW COMPRESSIVE FORCE, NON-SILICONE, HIGH THERMAL CONDUCTING FORMUL...

PATTERNED METAL THERMAL INTERFACE

Chip Cooling System with Convex Portion

THERMAL PASTE CONTAINMENT FOR SEMICONDUCTOR MODULES

THERMAL PILLOW

REVERSIBLE THERMAL THICKENING GREASE