Susmriti Das Mahapatra

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Tempe, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder thermal interface material (STIM) with dopant
- Patent number 12,166,004
- Issue date Dec 10, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package architectures containing a die back side metal a...
- Patent number 12,040,246
- Issue date Jul 16, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lids for integrated circuit packages with solder thermal interface...
- Patent number 11,817,369
- Issue date Nov 14, 2023
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20240332112
- Publication date Oct 3, 2024
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-SCALE PACKAGE ARCHITECTURES CONTAINING A DIE BACK SIDE METAL A...
- Publication number 20220102234
- Publication date Mar 31, 2022
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE...
- Publication number 20200388554
- Publication date Dec 10, 2020
- Intel Corporation
- Bamidele Daniel Falola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER THERMAL INTERFACE MATERIAL (STIM) WITH DOPANT
- Publication number 20200357764
- Publication date Nov 12, 2020
- Intel Corporation
- Susmriti Das Mahapatra
- H01 - BASIC ELECTRIC ELEMENTS