Susumu Arai

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Metal electrode and bonding method using the metal electrode
- Patent number 7,078,330
- Issue date Jul 18, 2006
- Mitsubishi Denki Kabushiki Kaisha
- Akira Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Metal electrode and bonding method using the metal electrode
- Publication number 20040175917
- Publication date Sep 9, 2004
- Mitsubishi Denki Kabushiki Kaisha
- Akira Maeda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR