Susumu Baba

Person

Tsukuba-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Curable resin composition, adhesive agent, adhesive film, circuit s...
- Patent number 12,139,576
- Issue date Nov 12, 2024
- Sekisui Chemical Co., Ltd.
- Sayaka Wakioka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Interlayer insulating material and multilayer printed wiring board
- Patent number 11,873,398
- Issue date Jan 16, 2024
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- B32 - LAYERED PRODUCTS
Information Patent Grant
Cured body and multilayered substrate
- Patent number 10,767,051
- Issue date Sep 8, 2020
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
- Publication number 20220169827
- Publication date Jun 2, 2022
- Sekisui Chemical Co., Ltd
- Akiko KUBO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTERLAYER INSULATING MATERIAL AND MULTILAYER PRINTED WIRING BOARD
- Publication number 20210284833
- Publication date Sep 16, 2021
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...
- Publication number 20210009749
- Publication date Jan 14, 2021
- Sekisui Chemical Co., Ltd
- Sayaka WAKIOKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURED BODY AND MULTILAYERED SUBSTRATE
- Publication number 20200032059
- Publication date Jan 30, 2020
- SEKISUI CHEMICAL CO., LTD.
- Tatsushi Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
RESIN COMPOSITION AND MULTILAYER SUBSTRATE
- Publication number 20190031822
- Publication date Jan 31, 2019
- Sekisui Chemical Co., Ltd.
- Tatsushi Hayashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION AND MULTILAYER SUBSTRATE
- Publication number 20180213635
- Publication date Jul 26, 2018
- Sekisui Chemical Co., Ltd.
- Susumu Baba
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Susumu Baba

Person

Patents Grantslast 30 patents

Curable resin composition, adhesive agent, adhesive film, circuit s...

Interlayer insulating material and multilayer printed wiring board

Cured body and multilayered substrate

Patents Applicationslast 30 patents

RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD

INTERLAYER INSULATING MATERIAL AND MULTILAYER PRINTED WIRING BOARD

CURABLE RESIN COMPOSITION, ADHESIVE AGENT, ADHESIVE FILM, CIRCUIT S...

CURED BODY AND MULTILAYERED SUBSTRATE

RESIN COMPOSITION AND MULTILAYER SUBSTRATE

RESIN COMPOSITION AND MULTILAYER SUBSTRATE