Susumu Maniwa

Person

Kasukabe-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer circuit board with LC resonant circuit and electronic co...
- Patent number 12,101,074
- Issue date Sep 24, 2024
- TOPPAN INC.
- Noriko Kanou
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Glass core multilayer wiring board and method of producing the same
- Patent number 11,877,394
- Issue date Jan 16, 2024
- TOPPAN INC.
- Susumu Maniwa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 11,303,261
- Issue date Apr 12, 2022
- Toppan Printing Co., Ltd.
- Tomoyuki Shirasaki
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Manufacturing method of lead frame substrate
- Patent number 8,703,598
- Issue date Apr 22, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate and method of manufacturing the same, and semi...
- Patent number 8,558,363
- Issue date Oct 15, 2013
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of lead frame substrate and semiconductor appa...
- Patent number 8,546,940
- Issue date Oct 1, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing substrate for semiconductor element, and se...
- Patent number 8,535,987
- Issue date Sep 17, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate for semiconductor element
- Patent number 8,535,979
- Issue date Sep 17, 2013
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing substrate for semiconductor element, and s...
- Patent number 8,466,547
- Issue date Jun 18, 2013
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate, manufacturing method thereof, and semiconduct...
- Patent number 8,390,105
- Issue date Mar 5, 2013
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for semiconductor element, method for manufacturing subst...
- Patent number 8,319,322
- Issue date Nov 27, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame substrate and method of manufacturing the same
- Patent number 8,304,294
- Issue date Nov 6, 2012
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER WIRING SUBSTRATE AND MODULE HAVING MULTILAYER WIRING SUB...
- Publication number 20230111374
- Publication date Apr 13, 2023
- TOPPAN INC.
- Noriko KANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER, HI...
- Publication number 20230039184
- Publication date Feb 9, 2023
- TOPPAN INC.
- Susumu MANIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
GLASS CORE MULTILAYER WIRING BOARD AND METHOD OF PRODUCING THE SAME
- Publication number 20220279651
- Publication date Sep 1, 2022
- TOPPAN INC.
- Susumu MANIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER CIRCUIT BOARD WITH LC RESONANT CIRCUIT AND ELECTRONIC CO...
- Publication number 20220109416
- Publication date Apr 7, 2022
- TOPPAN INC.
- Noriko KANOU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
CIRCUIT BOARD
- Publication number 20210143787
- Publication date May 13, 2021
- Toppan Printing Co.,Ltd.
- Tomoyuki SHIRASAKI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE
- Publication number 20140021162
- Publication date Jan 23, 2014
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT
- Publication number 20130112652
- Publication date May 9, 2013
- Toppan Printing Co., Ltd.
- Junko TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120061809
- Publication date Mar 15, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120061829
- Publication date Mar 15, 2012
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...
- Publication number 20120018860
- Publication date Jan 26, 2012
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBST...
- Publication number 20120018867
- Publication date Jan 26, 2012
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPA...
- Publication number 20110169145
- Publication date Jul 14, 2011
- Toppan Printing Co., Ltd.
- Susumu Maniwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame substrate and method of manufacturing the same
- Publication number 20110169153
- Publication date Jul 14, 2011
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...
- Publication number 20110163433
- Publication date Jul 7, 2011
- Toppan Printing Co., Ltd.
- Junko Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame substrate and method of manufacturing the same, and semi...
- Publication number 20110163435
- Publication date Jul 7, 2011
- Toppan Printing Co., Ltd.
- Takehito Tsukamoto
- H01 - BASIC ELECTRIC ELEMENTS

Susumu Maniwa

Person

Patents Grantslast 30 patents

Multilayer circuit board with LC resonant circuit and electronic co...

Glass core multilayer wiring board and method of producing the same

Circuit board

Manufacturing method of lead frame substrate

Lead frame substrate and method of manufacturing the same, and semi...

Manufacturing method of lead frame substrate and semiconductor appa...

Method of manufacturing substrate for semiconductor element, and se...

Method for manufacturing substrate for semiconductor element

Method for manufacturing substrate for semiconductor element, and s...

Lead frame substrate, manufacturing method thereof, and semiconduct...

Substrate for semiconductor element, method for manufacturing subst...

Lead frame substrate and method of manufacturing the same

Patents Applicationslast 30 patents

MULTILAYER WIRING SUBSTRATE AND MODULE HAVING MULTILAYER WIRING SUB...

GLASS CORE WIRING SUBSTRATE INCORPORATING HIGH-FREQUENCY FILTER, HI...

GLASS CORE MULTILAYER WIRING BOARD AND METHOD OF PRODUCING THE SAME

MULTILAYER CIRCUIT BOARD WITH LC RESONANT CIRCUIT AND ELECTRONIC CO...

CIRCUIT BOARD

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

METHOD FOR MANUFACTURING SUBSTRATE FOR SEMICONDUCTOR ELEMENT, AND S...

SUBSTRATE FOR SEMICONDUCTOR ELEMENT, METHOD FOR MANUFACTURING SUBST...

MANUFACTURING METHOD OF LEAD FRAME SUBSTRATE AND SEMICONDUCTOR APPA...

Lead frame substrate and method of manufacturing the same

LEAD FRAME SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCT...

Lead frame substrate and method of manufacturing the same, and semi...