Susumu Matsuoka

Person

Kadoma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit board and method for jointing circuit board
- Patent number 8,115,109
- Issue date Feb 14, 2012
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump forming method and bump forming apparatus
- Patent number 7,905,011
- Issue date Mar 15, 2011
- Panasonic Corporation
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing component built-in module, and component b...
- Patent number 7,488,895
- Issue date Feb 10, 2009
- Panasonic Corporation
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing a circuit board
- Patent number 6,691,409
- Issue date Feb 17, 2004
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and production of the same
- Patent number 6,518,514
- Issue date Feb 11, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for filling liquid crystal material
- Patent number 5,865,220
- Issue date Feb 2, 1999
- Matsushita Electric Industrial Co., Ltd.
- Chihiro Nakamura
- G02 - OPTICS
Information Patent Grant
Method and apparatus for filling liquid crystal material
- Patent number 5,862,839
- Issue date Jan 26, 1999
- Matsushita Electric Industrial Co., Ltd.
- Chihiro Nakamura
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD
- Publication number 20090266592
- Publication date Oct 29, 2009
- Panasonic Corporation
- Masayoshi Koyama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BUMP FORMING METHOD AND BUMP FORMING APPARATUS
- Publication number 20090229120
- Publication date Sep 17, 2009
- Yasushi Taniguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...
- Publication number 20090032285
- Publication date Feb 5, 2009
- Matsushita Electric Industrial Co., Ltd.
- Yoji Ueda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for manufacturing component built-in module, and component b...
- Publication number 20070119617
- Publication date May 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit board and production of the same
- Publication number 20030066683
- Publication date Apr 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Circuit board and production of the same
- Publication number 20020038725
- Publication date Apr 4, 2002
- MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
- Takeshi Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Susumu Matsuoka

Person

Patents Grantslast 30 patents

Circuit board and method for jointing circuit board

Bump forming method and bump forming apparatus

Method for manufacturing component built-in module, and component b...

Method of producing a circuit board

Circuit board and production of the same

Apparatus for filling liquid crystal material

Method and apparatus for filling liquid crystal material

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD FOR JOINTING CIRCUIT BOARD

BUMP FORMING METHOD AND BUMP FORMING APPARATUS

MULTI-LAYER CIRCUIT SUBSTRATE MANUFACTURING METHOD AND MULTI-LAYER...

Method for manufacturing component built-in module, and component b...

Circuit board and production of the same

Circuit board and production of the same