Susumu Nakamura

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Higashijou-machi, Nagano-shi, Nagano-ken, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a bonding substrate
- Patent number 6,110,391
- Issue date Aug 29, 2000
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer holding jig
- Patent number 5,938,512
- Issue date Aug 17, 1999
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- B24 - GRINDING POLISHING
Information Patent Grant
Bonded wafer and method of manufacturing it
- Patent number 5,340,435
- Issue date Aug 23, 1994
- Yatsuo Ito
- H01 - BASIC ELECTRIC ELEMENTS