Susumu Okikawa

Person

Ohme, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Wire-bonding method, wire-bonding apparatus, and semiconductor devi...
- Patent number 5,285,949
- Issue date Feb 15, 1994
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding method, wire-bonding apparatus,and semiconductor devic...
- Patent number 5,152,450
- Issue date Oct 6, 1992
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor integrated circuit device, method for producing or as...
- Patent number 5,031,821
- Issue date Jul 16, 1991
- Hitachi, Ltd.
- Tsuyoshi Kaneda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire-bonding method, wire-bonding apparatus, and semiconductor devi...
- Patent number 4,998,002
- Issue date Mar 5, 1991
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and production process thereof, as well as wir...
- Patent number 4,976,393
- Issue date Dec 11, 1990
- Hitachi, Ltd.
- Makoto Nakajima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of bonding insulated and coated wire
- Patent number 4,950,866
- Issue date Aug 21, 1990
- Hitachi, Ltd.
- Toosaku Kojima
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 4,845,543
- Issue date Jul 4, 1989
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame and semiconductor device using the same
- Patent number 4,791,472
- Issue date Dec 13, 1988
- Hitachi, Ltd.
- Susumu Okikawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder
- Patent number 4,564,734
- Issue date Jan 14, 1986
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated semiconductor device with a metallic base plate
- Patent number 4,326,215
- Issue date Apr 20, 1982
- Hitachi, Ltd.
- Hiromichi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of providing semiconductor pellet with heat sink
- Patent number 4,123,293
- Issue date Oct 31, 1978
- Hitachi, Ltd.
- Susumu Okikawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin-sealed type semiconductor devices and manufacturing method of...
- Patent number 4,100,566
- Issue date Jul 11, 1978
- Hitachi, Ltd.
- Susumu Okikawa
- H01 - BASIC ELECTRIC ELEMENTS

Susumu Okikawa

Person

Patents Grantslast 30 patents

Wire-bonding method, wire-bonding apparatus, and semiconductor devi...

Wire-bonding method, wire-bonding apparatus,and semiconductor devic...

Semiconductor integrated circuit device, method for producing or as...

Wire-bonding method, wire-bonding apparatus, and semiconductor devi...

Semiconductor device and production process thereof, as well as wir...

Method and apparatus of bonding insulated and coated wire

Semiconductor device and method of manufacturing the same

Lead frame and semiconductor device using the same

Wire bonder

Encapsulated semiconductor device with a metallic base plate

Method of providing semiconductor pellet with heat sink

Resin-sealed type semiconductor devices and manufacturing method of...