Susumu TAKAGI

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Kumagaya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Tool management method of die bonder and die bonder
- Patent number 8,593,261
- Issue date Nov 26, 2013
- Hitachi High-Tech Instruments Co., Ltd.
- Susumu Takagi
- G05 - CONTROLLING REGULATING

Patents Applicationslast 30 patents

Information Patent Application
Tool Management Method of Die Bonder and Die Bonder
- Publication number 20120075079
- Publication date Mar 29, 2012
- Hitachi High-Tech Instruments Co., Ltd.
- Susumu TAKAGI
- G05 - CONTROLLING REGULATING