Suzana Prstic

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package-level backside metallization (BSM)
- Patent number 11,652,061
- Issue date May 16, 2023
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip package with partial integrated heat spreader
- Patent number 11,004,768
- Issue date May 11, 2021
- Intel Corporation
- Muhammad S. Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, and a method for forming a semiconductor pac...
- Patent number 10,290,592
- Issue date May 14, 2019
- Intel Corporation
- John J Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plurality of stiffeners with thickness variation
- Patent number 9,799,610
- Issue date Oct 24, 2017
- Intel Corporation
- Mingjie Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System including thermal control unit having conduit for dispense a...
- Patent number 8,410,802
- Issue date Apr 2, 2013
- Intel Corporation
- Ashish Gupta
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Liquid TIM dispense and removal method and assembly
- Patent number 7,982,478
- Issue date Jul 19, 2011
- Intel Corporation
- Nader Abazarnia
- G01 - MEASURING TESTING
Information Patent Grant
Soldering a die to a substrate
- Patent number 7,332,423
- Issue date Feb 19, 2008
- Intel Corporation
- Robert Starkston
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER
- Publication number 20210035886
- Publication date Feb 4, 2021
- Intel Corporation
- Muhammad S. Islam
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)
- Publication number 20200395307
- Publication date Dec 17, 2020
- Intel Corporation
- Shenavia S. Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package, and a Method for Forming a Semiconductor Pac...
- Publication number 20190006293
- Publication date Jan 3, 2019
- Intel Corporation
- John J Beatty
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN...
- Publication number 20170179043
- Publication date Jun 22, 2017
- Intel Corporation
- Mingjie Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM
- Publication number 20110155348
- Publication date Jun 30, 2011
- Ashish GUPTA
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
LIQUID TIM DISPENSE AND REMOVAL METHOD AND ASSEMBLY
- Publication number 20100164510
- Publication date Jul 1, 2010
- Nader Abazarnia
- G01 - MEASURING TESTING
Information Patent Application
Soldering a die to a substrate
- Publication number 20070001318
- Publication date Jan 4, 2007
- Robert Starkston
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Thermal management device for an integrated circuit
- Publication number 20050111188
- Publication date May 26, 2005
- Anandaroop Bhattacharya
- H01 - BASIC ELECTRIC ELEMENTS

Suzana Prstic

Person

Patents Grantslast 30 patents

Package-level backside metallization (BSM)

Multi-chip package with partial integrated heat spreader

Semiconductor package, and a method for forming a semiconductor pac...

Plurality of stiffeners with thickness variation

System including thermal control unit having conduit for dispense a...

Liquid TIM dispense and removal method and assembly

Soldering a die to a substrate

Patents Applicationslast 30 patents

MULTI-CHIP PACKAGE WITH PARTIAL INTEGRATED HEAT SPREADER

PACKAGE-LEVEL BACKSIDE METALLIZATION (BSM)

Semiconductor Package, and a Method for Forming a Semiconductor Pac...

SYSTEMS, METHODS AND DEVICES FOR STIFFENER CONSTRUCTION FOR USE IN...

LIQUID THERMAL INTERFACE MATERIAL DISPENSE AND REMOVAL SYSTEM

LIQUID TIM DISPENSE AND REMOVAL METHOD AND ASSEMBLY

Soldering a die to a substrate

Thermal management device for an integrated circuit