Sven Evers

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,921,017
- Issue date Jul 26, 2005
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method, device and system for semiconductor wafer transfer
- Patent number 6,817,823
- Issue date Nov 16, 2004
- Marian Corporation
- Edward R. Fix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 6,709,967
- Issue date Mar 23, 2004
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,634,538
- Issue date Oct 21, 2003
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,588,649
- Issue date Jul 8, 2003
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 6,390,853
- Issue date May 21, 2002
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,375,061
- Issue date Apr 23, 2002
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,352,191
- Issue date Mar 5, 2002
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 6,211,053
- Issue date Apr 3, 2001
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for applying atomized adhesive to a leadframe...
- Patent number 6,159,609
- Issue date Dec 12, 2000
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,138,891
- Issue date Oct 31, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for applying atomized adhesive to a leadframe for chip bonding
- Patent number 6,132,798
- Issue date Oct 17, 2000
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for applying atomized adhesive to a leadframe for chip bo...
- Patent number 6,129,039
- Issue date Oct 10, 2000
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,126,062
- Issue date Oct 3, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Patent number 6,105,846
- Issue date Aug 22, 2000
- Micron Technology, Inc.
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for applying atomized adhesive to a leadframe...
- Patent number 6,030,711
- Issue date Feb 29, 2000
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 6,001,725
- Issue date Dec 14, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame casing
- Patent number 5,996,805
- Issue date Dec 7, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for verifying the presence or absence of a com...
- Patent number 5,962,862
- Issue date Oct 5, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 5,956,607
- Issue date Sep 21, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for applying atomized adhesive to a leadframe...
- Patent number 5,874,322
- Issue date Feb 23, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 5,872,405
- Issue date Feb 16, 1999
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame casing
- Patent number 5,836,454
- Issue date Nov 17, 1998
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for applying atomized adhesive to a leadframe...
- Patent number 5,810,926
- Issue date Sep 22, 1998
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Patent number 5,731,244
- Issue date Mar 24, 1998
- Micron Technology, Inc.
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20040026486
- Publication date Feb 12, 2004
- Sven Evers
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method, device and system for semiconductor wafer transfer
- Publication number 20030057130
- Publication date Mar 27, 2003
- Edward R. Fix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Publication number 20020130114
- Publication date Sep 19, 2002
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20020066775
- Publication date Jun 6, 2002
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Non-conductive and self-leveling leadframe clamp insert for wirebon...
- Publication number 20020043548
- Publication date Apr 18, 2002
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser wire bonding for wire embedded dielectrics to integrated circ...
- Publication number 20010008792
- Publication date Jul 19, 2001
- Sven Evers
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Method, device and system for semiconductor wafer transfer

Laser wire bonding for wire embedded dielectrics to integrated circ...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Method and apparatus for applying atomized adhesive to a leadframe...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Method for applying atomized adhesive to a leadframe for chip bonding

Apparatus for applying atomized adhesive to a leadframe for chip bo...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Method and apparatus for applying atomized adhesive to a leadframe...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Lead frame casing

Method and apparatus for verifying the presence or absence of a com...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Method and apparatus for applying atomized adhesive to a leadframe...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Lead frame casing

Method and apparatus for applying atomized adhesive to a leadframe...

Laser wire bonding for wire embedded dielectrics to integrated circ...

Patents Applicationslast 30 patents

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Method, device and system for semiconductor wafer transfer

Laser wire bonding for wire embedded dielectrics to integrated circ...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Non-conductive and self-leveling leadframe clamp insert for wirebon...

Laser wire bonding for wire embedded dielectrics to integrated circ...