Sven Rückbrod

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Schonefeld, DE

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Patents Grantslast 30 patents

Information Patent Grant
Electrolytic copper plating bath compositions and a method for thei...
- Patent number 10,538,850
- Issue date Jan 21, 2020
- Atotech Deutschland GmbH
- Heiko Brunner
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating bath for electroless deposition of nickel layers
- Patent number 9,175,399
- Issue date Nov 3, 2015
- Atotech Deutschland GmbH
- Heiko Brunner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALL...
- Publication number 20180340261
- Publication date Nov 29, 2018
- Atotech Deutschland GmbH
- Andreas WALTER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROLYTIC COPPER PLATING BATH COMPOSITIONS AND A METHOD FOR THEI...
- Publication number 20180112320
- Publication date Apr 26, 2018
- Atotech Deutschland GmbH
- Heiko BRUNNER
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING BATH FOR ELECTROLESS DEPOSITION OF NICKEL LAYERS
- Publication number 20150110965
- Publication date Apr 23, 2015
- Atotech Deutschland GmbH
- Heiko Brunner
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...