Sw Wang

Person

Seremban, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Thin semiconductor package for notched semiconductor die
- Patent number 11,942,369
- Issue date Mar 26, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,791,297
- Issue date Oct 17, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded semiconductor package and related methods
- Patent number 11,244,918
- Issue date Feb 8, 2022
- Semiconductor Components Industries, LLC
- Sw Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,763,173
- Issue date Sep 1, 2020
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with grounding device and related methods
- Patent number 10,699,989
- Issue date Jun 30, 2020
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin semiconductor package and related methods
- Patent number 10,319,639
- Issue date Jun 11, 2019
- Semiconductor Components Industries, LLC
- Shutesh Krishnan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with grounding device and related methods
- Patent number 10,056,317
- Issue date Aug 21, 2018
- Semiconductor Components Industries, LLC
- Atapol Prajuckamol
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20240006363
- Publication date Jan 4, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220157756
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20200357697
- Publication date Nov 12, 2020
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190252255
- Publication date Aug 15, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH GROUNDING DEVICE AND RELATED METHODS
- Publication number 20190122963
- Publication date Apr 25, 2019
- Semiconductor Components Industries, LLC
- Atapol PRAJUCKAMOL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057947
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Sw WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20190057900
- Publication date Feb 21, 2019
- Semiconductor Components Industries, LLC
- Shutesh KRISHNAN
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Thin semiconductor package for notched semiconductor die

Molded semiconductor package and related methods

Molded semiconductor package and related methods

Thin semiconductor package and related methods

Semiconductor package with grounding device and related methods

Thin semiconductor package and related methods

Semiconductor package with grounding device and related methods

Patents Applicationslast 30 patents

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS

SEMICONDUCTOR PACKAGE WITH GROUNDING DEVICE AND RELATED METHODS

MOLDED SEMICONDUCTOR PACKAGE AND RELATED METHODS

THIN SEMICONDUCTOR PACKAGE AND RELATED METHODS