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Swain Hong Yeo
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Singapore, SG
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Patents Grants
last 30 patents
Information
Patent Grant
Molded semiconductor package having a package-in-package structure...
Patent number
10,861,828
Issue date
Dec 8, 2020
Infineon Technologies AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package-in-package structure for semiconductor devices and methods...
Patent number
10,418,343
Issue date
Sep 17, 2019
Infineon Technologies AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package and a method for forming an integrated c...
Patent number
8,357,565
Issue date
Jan 22, 2013
Infinenon Technologies AG
Gerald Ofner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Magnetically alignable integrated circuit device
Patent number
7,994,608
Issue date
Aug 9, 2011
Infineon Technologies AG
Ai Min Tan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Molded Semiconductor Package Having a Package-in-Package Structure...
Publication number
20190348397
Publication date
Nov 14, 2019
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package-in-Package Structure for Semiconductor Devices and Methods...
Publication number
20190172815
Publication date
Jun 6, 2019
INFINEON TECHNOLOGIES AG
Hui Teng Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Magnetically Alignable Integrated Circuit Device
Publication number
20080265367
Publication date
Oct 30, 2008
INFINEON TECHNOLOGIES AG
Ai Min Tan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and a Method for Forming an Integrated C...
Publication number
20080122053
Publication date
May 29, 2008
Gerald Ofner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Attachment of flip chips to substrates
Publication number
20060115927
Publication date
Jun 1, 2006
Infineon Technologies AG
Swain Hong Alfred Yeo
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR