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Swati V. Joshi
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Durham, NC, US
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last 30 patents
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Patent Grant
Method and apparatus for controlling plating thickness of a workpiece
Patent number
5,788,829
Issue date
Aug 4, 1998
Mitsubishi Semiconductor America, Inc.
Swati V. Joshi
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Method and apparatus using an anode basket for electroplating a wor...
Patent number
5,776,327
Issue date
Jul 7, 1998
Mitsubishi Semiconuctor Americe, Inc.
Robert R. Botts
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Grant
Anode basket for controlling plating thickness distribution
Patent number
5,744,013
Issue date
Apr 28, 1998
Mitsubishi Semiconductor America, Inc.
Robert R Botts
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR