Swee Guan Chan

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Melaka, MY

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having a copper pillar interconnect structure
- Patent number 11,152,321
- Issue date Oct 19, 2021
- Infineon Technologies AG
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor Device Having a Copper Pillar Interconnect Structure
- Publication number 20200258855
- Publication date Aug 13, 2020
- Carlo Marbella
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Elimination of Die-Top Delamination
- Publication number 20140339690
- Publication date Nov 20, 2014
- Swee Guan Chan
- H01 - BASIC ELECTRIC ELEMENTS