Swee Peng Lee

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Penang, MY

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Patents Grantslast 30 patents

Information Patent Grant
Method and system for aligning IC die to package substrate
- Patent number 7,052,968
- Issue date May 30, 2006
- Advanced Micro Devices, Inc.
- Swee Peng Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inspection for alignment between IC die and package substrate
- Patent number 7,030,772
- Issue date Apr 18, 2006
- Advanced Micro Devices, Inc.
- Swee Peng Lee
- H01 - BASIC ELECTRIC ELEMENTS