Swetha Kamlapurkar

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Ossining, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Stress engineered multi-layers for integration of CMOS and Si nanop...
- Patent number 9,087,952
- Issue date Jul 21, 2015
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Far back end of the line stack encapsulation
- Patent number 8,994,177
- Issue date Mar 31, 2015
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Far back end of the line stack encapsulation
- Patent number 8,932,956
- Issue date Jan 13, 2015
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress engineered multi-layers for integration of CMOS and Si nanop...
- Patent number 8,765,536
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRESS ENGINEERED MULTI-LAYERS FOR INTEGRATION OF CMOS AND Si NANOP...
- Publication number 20140217485
- Publication date Aug 7, 2014
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAR BACK END OF THE LINE STACK ENCAPSULATION
- Publication number 20140151894
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAR BACK END OF THE LINE STACK ENCAPSULATION
- Publication number 20140151898
- Publication date Jun 5, 2014
- International Business Machines Corporation
- Tymon Barwicz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRESS ENGINEERED MULTI-LAYERS FOR INTEGRATION OF CMOS AND Si NANOP...
- Publication number 20140091374
- Publication date Apr 3, 2014
- International Business Machines Corporation
- Solomon Assefa
- H01 - BASIC ELECTRIC ELEMENTS