Syadwad Jain

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,652,018
- Issue date May 16, 2023
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader edge standoffs for managing bondline thickness in mic...
- Patent number 11,062,970
- Issue date Jul 13, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreaders with interlocked inserts
- Patent number 10,969,840
- Issue date Apr 6, 2021
- Intel Corporation
- Aravindha R. Antoniswamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated heat spreader having electromagnetically-formed features
- Patent number 10,763,188
- Issue date Sep 1, 2020
- Intel Corporation
- Aravindha R. Antoniswamy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Foam composite
- Patent number 10,651,108
- Issue date May 12, 2020
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Multiple-chip package with multiple thermal interface materials
- Patent number 10,580,717
- Issue date Mar 3, 2020
- Intel Corporation
- Boxi Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer thermal interface material having enhanced thermal conducti...
- Patent number 10,056,314
- Issue date Aug 21, 2018
- Intel Corporation
- Randall D. Lowe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer thermal interface material having enhanced thermal conducti...
- Patent number 9,070,660
- Issue date Jun 30, 2015
- Intel Corporation
- Randall Lowe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Paste thermal interface materials
- Patent number 8,896,110
- Issue date Nov 25, 2014
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded heat spreaders
- Patent number 8,866,290
- Issue date Oct 21, 2014
- Intel Corporation
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL

Patents Applicationslast 30 patents

Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20210305118
- Publication date Sep 30, 2021
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SPREADERS WITH INTERLOCKED INSERTS
- Publication number 20190079567
- Publication date Mar 14, 2019
- Intel Corporation
- Aravindha R. Antoniswamy
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...
- Publication number 20190067153
- Publication date Feb 28, 2019
- Intel Corporation
- Dinesh P. R. Thanu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINTERED HEAT SPREADERS WITH INSERTS
- Publication number 20190027379
- Publication date Jan 24, 2019
- Intel Corporation
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS
- Publication number 20180374776
- Publication date Dec 27, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...
- Publication number 20180323130
- Publication date Nov 8, 2018
- Intel Corporation
- Boxi LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOAM COMPOSITE
- Publication number 20180005917
- Publication date Jan 4, 2018
- Zhizhong Tang
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Integrated heat spreader having electromagnetically-formed features
- Publication number 20170186628
- Publication date Jun 29, 2017
- Intel Corporation
- Aravindha R. Antoniswamy
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
POLYMER THERMAL INTERFACE MATERIAL HAVING ENHANCED THERMAL CONDUCTI...
- Publication number 20140264818
- Publication date Sep 18, 2014
- Randall D. Lowe
- B32 - LAYERED PRODUCTS
Information Patent Application
MOLDED HEAT SPREADERS
- Publication number 20140264821
- Publication date Sep 18, 2014
- Zhizhong Tang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PASTE THERMAL INTERFACE MATERIALS
- Publication number 20140264820
- Publication date Sep 18, 2014
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS

Syadwad Jain

Person

Patents Grantslast 30 patents

Heat spreader edge standoffs for managing bondline thickness in mic...

Heat spreader edge standoffs for managing bondline thickness in mic...

Heat spreaders with interlocked inserts

Integrated heat spreader having electromagnetically-formed features

Foam composite

Multiple-chip package with multiple thermal interface materials

Polymer thermal interface material having enhanced thermal conducti...

Polymer thermal interface material having enhanced thermal conducti...

Paste thermal interface materials

Molded heat spreaders

Patents Applicationslast 30 patents

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

HEAT SPREADERS WITH INTERLOCKED INSERTS

HEAT SPREADER EDGE STANDOFFS FOR MANAGING BONDLINE THICKNESS IN MIC...

SINTERED HEAT SPREADERS WITH INSERTS

MULTIPLE-CHIP PACKAGE WITH MULTIPLE THERMAL INTERFACE MATERIALS

ADHESIVE POLYMER THERMAL INTERFACE MATERIAL WITH SINTERED FILLERS F...

FOAM COMPOSITE

Integrated heat spreader having electromagnetically-formed features

POLYMER THERMAL INTERFACE MATERIAL HAVING ENHANCED THERMAL CONDUCTI...

MOLDED HEAT SPREADERS

PASTE THERMAL INTERFACE MATERIALS