Sychyi Fang

Person

Palo Alto, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 8,258,065
- Issue date Sep 4, 2012
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Passive elements, articles, packages, semiconductor composites, and...
- Patent number 7,605,092
- Issue date Oct 20, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating low K dielectric interconnect systems by using dummy st...
- Patent number 6,309,956
- Issue date Oct 30, 2001
- Intel Corporation
- Chien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating an interconnect structure with hard mask and...
- Patent number 6,027,995
- Issue date Feb 22, 2000
- Intel Corporation
- Chien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure and method to achieve unlanded vias for low...
- Patent number 5,935,868
- Issue date Aug 10, 1999
- Intel Corporation
- Sychyi Fang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure with hard mask and low dielectric constant m...
- Patent number 5,886,410
- Issue date Mar 23, 1999
- Intel Corporation
- Chien Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unlanded via structure and method for making same
- Patent number 5,880,030
- Issue date Mar 9, 1999
- Intel Corporation
- Sychyi Fang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...
- Publication number 20090004807
- Publication date Jan 1, 2009
- Silicon Storage Technology, Inc.
- Bomy Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Under bump metallurgy structure of a package and method of making same
- Publication number 20080169539
- Publication date Jul 17, 2008
- Silicon Storage Tech., Inc.
- Sychyi Fang
- H01 - BASIC ELECTRIC ELEMENTS

Sychyi Fang

Person

Patents Grantslast 30 patents

Passive elements, articles, packages, semiconductor composites, and...

Passive elements, articles, packages, semiconductor composites, and...

Fabricating low K dielectric interconnect systems by using dummy st...

Method for fabricating an interconnect structure with hard mask and...

Interconnect structure and method to achieve unlanded vias for low...

Interconnect structure with hard mask and low dielectric constant m...

Unlanded via structure and method for making same

Patents Applicationslast 30 patents

PASSIVE ELEMENTS, ARTICLES, PACKAGES, SEMICONDUCTOR COMPOSITES, AND...

Under bump metallurgy structure of a package and method of making same