Syed S. Ahmad

Person

Fargo, ND, US

People

Patents Grantslast 30 patents

Information Patent Grant
Devices including sloped vias in a substrate and devices including...
- Patent number 7,928,579
- Issue date Apr 19, 2011
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with permanent polymer stencil and method for...
- Patent number 7,589,010
- Issue date Sep 15, 2009
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sloped vias in a substrate, spring-like contacts, and methods of ma...
- Patent number 7,390,740
- Issue date Jun 24, 2008
- Micron Technology, Inc.
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collar positionable about a periphery of a contact pad and around a...
- Patent number 7,169,693
- Issue date Jan 30, 2007
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collars, support structures, and forms for protruding conductive st...
- Patent number 7,095,106
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for modifying the configuration of an exposed surface of...
- Patent number 7,087,116
- Issue date Aug 8, 2006
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stereolithographic method for fabricating stabilizers for semicondu...
- Patent number 7,041,533
- Issue date May 9, 2006
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor devices with permanent polymer stencil and method for...
- Patent number 6,998,334
- Issue date Feb 14, 2006
- Micron Technology, Inc.
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting substrates for electrical coupling of microelectron...
- Patent number 6,983,551
- Issue date Jan 10, 2006
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Interconnecting substrates for electrical coupling of microelectron...
- Patent number 6,982,386
- Issue date Jan 3, 2006
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a leadframe to singulated semiconductor dice
- Patent number 6,979,598
- Issue date Dec 27, 2005
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stabilizers for flip-chip type semiconductor devices and semiconduc...
- Patent number 6,946,732
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for controlling the depth of immersion of a semiconductor el...
- Patent number 6,919,229
- Issue date Jul 19, 2005
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collar positionable about a periphery of a contact pad and around a...
- Patent number 6,911,735
- Issue date Jun 28, 2005
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus and method for modifying the configuration of an exposed...
- Patent number 6,890,384
- Issue date May 10, 2005
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying adhesives to a lead frame
- Patent number 6,818,460
- Issue date Nov 16, 2004
- Micron Technology, Inc.
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,803,657
- Issue date Oct 12, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of Interconnecting substrates for electrical coupling of mic...
- Patent number 6,796,028
- Issue date Sep 28, 2004
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a leadframe to singulated semiconductor dice
- Patent number 6,706,559
- Issue date Mar 16, 2004
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes including offsets extending from a major plane thereof,...
- Patent number 6,703,260
- Issue date Mar 9, 2004
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test carrier with molded interconnect for testing semiconductor com...
- Patent number 6,642,730
- Issue date Nov 4, 2003
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Method for gravitation-assisted control of spread of viscous materi...
- Patent number 6,602,730
- Issue date Aug 5, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Collar positionable about a periphery of a contact pad and around a...
- Patent number 6,569,753
- Issue date May 27, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test carrier with molded interconnect for testing semiconductor com...
- Patent number 6,544,461
- Issue date Apr 8, 2003
- Micron Technology, Inc.
- David R. Hembree
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit devices including connection components mechanic...
- Patent number 6,528,867
- Issue date Mar 4, 2003
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Collar positionable about a periphery of a contact pad and around a...
- Patent number 6,525,408
- Issue date Feb 25, 2003
- Micron Technology, Inc.
- Salman Akram
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of attaching a leadframe to singulated semiconductor dice
- Patent number 6,506,628
- Issue date Jan 14, 2003
- Micron Technology, Inc.
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframes including offsets extending from a major plane thereof,...
- Patent number 6,500,697
- Issue date Dec 31, 2002
- Micron Technology, Inc.
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gravitationally assisted control of spread of viscous material appl...
- Patent number 6,492,713
- Issue date Dec 10, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gravitationally-assisted control of spread of viscous material appl...
- Patent number 6,489,681
- Issue date Dec 3, 2002
- Micron Technology, Inc.
- Tongbi Jiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Sloped vias in a substrate, spring-like deflecting contacts, and me...
- Publication number 20070045857
- Publication date Mar 1, 2007
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Sloped vias in a substrate, spring-like deflecting contacts, and me...
- Publication number 20060046475
- Publication date Mar 2, 2006
- James M. Wark
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Collars, support structures, and forms for protuding conductive str...
- Publication number 20060017175
- Publication date Jan 26, 2006
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor devices with permanent polymer stencil and method for...
- Publication number 20060003569
- Publication date Jan 5, 2006
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for modifying semiconductor devices to stabilize the same a...
- Publication number 20050282313
- Publication date Dec 22, 2005
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of attaching a leadframe to singulated semiconductor dice
- Publication number 20050255612
- Publication date Nov 17, 2005
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods including fabrication of substrates and other semiconductor...
- Publication number 20050208704
- Publication date Sep 22, 2005
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of attaching a leadframe to singulated semiconductor dice
- Publication number 20040175863
- Publication date Sep 9, 2004
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Handling system for use with programmable material consolidation sy...
- Publication number 20040167663
- Publication date Aug 26, 2004
- William M. Hiatt
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Programmed material consolidation systems including multiple fabric...
- Publication number 20040164461
- Publication date Aug 26, 2004
- Syed Sajid Ahmad
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semiconductor devices with permanent polymer stencil and method for...
- Publication number 20040005770
- Publication date Jan 8, 2004
- Warren M. Farnworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collar positionable about a periphery of a contact pad and around a...
- Publication number 20030203612
- Publication date Oct 30, 2003
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Apparatus for modifying the configuration of an exposed surface of...
- Publication number 20030116085
- Publication date Jun 26, 2003
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Interconnecting substrates for electrical coupling of microelectron...
- Publication number 20030109083
- Publication date Jun 12, 2003
- Syed Sajid Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Interconnecting substrates for electrical coupling of microelectron...
- Publication number 20030106709
- Publication date Jun 12, 2003
- Syed Sajid Ahmad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Leadframes including offsets extending from a major plane thereof,...
- Publication number 20030104656
- Publication date Jun 5, 2003
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collar positionable about a periphery of a contact pad and around a...
- Publication number 20030098499
- Publication date May 29, 2003
- Salman Akram
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Interconnecting substrates for electrical coupling of microelectron...
- Publication number 20030029633
- Publication date Feb 13, 2003
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gravitationally assisted control of spread of viscous material appl...
- Publication number 20020197843
- Publication date Dec 26, 2002
- Tongbi jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of attaching a leadframe to singulated semiconductor dice
- Publication number 20020197772
- Publication date Dec 26, 2002
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collar positionable about a periphery of a contact pad and around a...
- Publication number 20020105074
- Publication date Aug 8, 2002
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Collar positionable about a periphery of a contact pad and around a...
- Publication number 20020100973
- Publication date Aug 1, 2002
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframes including offsets extending from a major plane thereof,...
- Publication number 20020048852
- Publication date Apr 25, 2002
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stereolithographic method and apparatus for fabricating stabilizers...
- Publication number 20020043711
- Publication date Apr 18, 2002
- Salman Akram
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for applying adhesives to a lead frame
- Publication number 20020029743
- Publication date Mar 14, 2002
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for controlling the depth of immersion of a se...
- Publication number 20020029741
- Publication date Mar 14, 2002
- Syed Sajid Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for modifying the configuration of an exposed...
- Publication number 20020029742
- Publication date Mar 14, 2002
- Walter L. Moden
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRAVITATIONALLY-ASSISTED CONTROL OF SPREAD OF VISCOUS MATERIAL APPL...
- Publication number 20020001879
- Publication date Jan 3, 2002
- TONGBI JIANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of attaching a leadframe to singulated semiconductor dice
- Publication number 20010055837
- Publication date Dec 27, 2001
- Tongbi Jiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE CONDUCTIVE STRUCTURES AND METHOD
- Publication number 20010050568
- Publication date Dec 13, 2001
- SYED SAJID AHMAD
- G01 - MEASURING TESTING

Syed S. Ahmad

Person

Patents Grantslast 30 patents

Devices including sloped vias in a substrate and devices including...

Semiconductor devices with permanent polymer stencil and method for...

Sloped vias in a substrate, spring-like contacts, and methods of ma...

Collar positionable about a periphery of a contact pad and around a...

Collars, support structures, and forms for protruding conductive st...

Apparatus for modifying the configuration of an exposed surface of...

Stereolithographic method for fabricating stabilizers for semicondu...

Semiconductor devices with permanent polymer stencil and method for...

Interconnecting substrates for electrical coupling of microelectron...

Interconnecting substrates for electrical coupling of microelectron...

Method of attaching a leadframe to singulated semiconductor dice

Stabilizers for flip-chip type semiconductor devices and semiconduc...

Method for controlling the depth of immersion of a semiconductor el...

Collar positionable about a periphery of a contact pad and around a...

Apparatus and method for modifying the configuration of an exposed...

Method for applying adhesives to a lead frame

Gravitationally-assisted control of spread of viscous material appl...

Method of Interconnecting substrates for electrical coupling of mic...

Method of attaching a leadframe to singulated semiconductor dice

Leadframes including offsets extending from a major plane thereof,...

Test carrier with molded interconnect for testing semiconductor com...

Method for gravitation-assisted control of spread of viscous materi...

Collar positionable about a periphery of a contact pad and around a...

Test carrier with molded interconnect for testing semiconductor com...

Integrated circuit devices including connection components mechanic...

Collar positionable about a periphery of a contact pad and around a...

Method of attaching a leadframe to singulated semiconductor dice

Leadframes including offsets extending from a major plane thereof,...

Gravitationally assisted control of spread of viscous material appl...

Gravitationally-assisted control of spread of viscous material appl...

Patents Applicationslast 30 patents

Sloped vias in a substrate, spring-like deflecting contacts, and me...

Sloped vias in a substrate, spring-like deflecting contacts, and me...

Collars, support structures, and forms for protuding conductive str...

Semiconductor devices with permanent polymer stencil and method for...

Methods for modifying semiconductor devices to stabilize the same a...

Method of attaching a leadframe to singulated semiconductor dice

Methods including fabrication of substrates and other semiconductor...

Method of attaching a leadframe to singulated semiconductor dice

Handling system for use with programmable material consolidation sy...

Programmed material consolidation systems including multiple fabric...

Semiconductor devices with permanent polymer stencil and method for...

Collar positionable about a periphery of a contact pad and around a...

Apparatus for modifying the configuration of an exposed surface of...

Interconnecting substrates for electrical coupling of microelectron...

Interconnecting substrates for electrical coupling of microelectron...

Leadframes including offsets extending from a major plane thereof,...

Collar positionable about a periphery of a contact pad and around a...

Interconnecting substrates for electrical coupling of microelectron...

Gravitationally assisted control of spread of viscous material appl...

Method of attaching a leadframe to singulated semiconductor dice

Collar positionable about a periphery of a contact pad and around a...

Collar positionable about a periphery of a contact pad and around a...

Leadframes including offsets extending from a major plane thereof,...

Stereolithographic method and apparatus for fabricating stabilizers...

Method and apparatus for applying adhesives to a lead frame

Apparatus and method for controlling the depth of immersion of a se...

Apparatus and method for modifying the configuration of an exposed...

GRAVITATIONALLY-ASSISTED CONTROL OF SPREAD OF VISCOUS MATERIAL APPL...

Method of attaching a leadframe to singulated semiconductor dice

FLEXIBLE CONDUCTIVE STRUCTURES AND METHOD