Sylvain Ouimet

Person

St-Hubert, QU, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Antenna packaging solution
- Patent number 10,615,511
- Issue date Apr 7, 2020
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna packaging solution
- Patent number 10,374,322
- Issue date Aug 6, 2019
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 10,211,174
- Issue date Feb 19, 2019
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,984,988
- Issue date May 29, 2018
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
All intermetallic compound with stand off feature and method to make
- Patent number 9,793,232
- Issue date Oct 17, 2017
- International Business Machines Corporation
- Charles L. Arvin
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Flip chip assembly with connected component
- Patent number 9,553,079
- Issue date Jan 24, 2017
- International Business Machines Corporation
- Jean Audet
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate peripheral clamping to control microelectronic module BSM...
- Patent number 9,219,051
- Issue date Dec 22, 2015
- GLOBALFOUNDRIES Inc.
- Stephanie Allard
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,559,474
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,421,217
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,290,008
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,202,765
- Issue date Jun 19, 2012
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of removing metallic, inorganic and organic contaminants fro...
- Patent number 7,771,541
- Issue date Aug 10, 2010
- International Business Machines Corporation
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for stress reduction in flip chip microelectro...
- Patent number 7,498,198
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,946,746
- Issue date Sep 20, 2005
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,737,296
- Issue date May 18, 2004
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wirebond passivation pad connection using heated capillary
- Patent number 6,605,526
- Issue date Aug 12, 2003
- International Business Machines Corporation
- Wayne John Howell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to reduce number of wire-bond loop heights versus the total...
- Patent number 6,414,386
- Issue date Jul 2, 2002
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe and leadframe assembly for parallel optical computer link
- Patent number 6,137,158
- Issue date Oct 24, 2000
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS
Information Patent Grant
Low-cost packaging for parallel optical computer link
- Patent number 5,781,682
- Issue date Jul 14, 1998
- International Business Machines Corporation
- Mitchell Simmons Cohen
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
ANTENNA PACKAGING SOLUTION
- Publication number 20190229433
- Publication date Jul 25, 2019
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA PACKAGING SOLUTION
- Publication number 20190140361
- Publication date May 9, 2019
- International Business Machines Corporation
- Jean Labonte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170133
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT
- Publication number 20170170134
- Publication date Jun 15, 2017
- International Business Machines Corporation
- JEAN AUDET
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...
- Publication number 20140359996
- Publication date Dec 11, 2014
- Stephanie Allard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20120326290
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...
- Publication number 20120175766
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20110044369
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
Method of Removing Metallic, Inorganic and Organic Contaminants Fro...
- Publication number 20100218894
- Publication date Sep 2, 2010
- International Business Machines Corporation
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Achieving Mechanical and Thermal Stability in...
- Publication number 20100181665
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...
- Publication number 20080265435
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Removing Metallic, Inorganic and Organic Contaminants fro...
- Publication number 20080233755
- Publication date Sep 25, 2008
- Claude Blais
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce number of wire-bond loop heights versus the total...
- Publication number 20040173893
- Publication date Sep 9, 2004
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to reduce number of wire-bond loop heights versus the total...
- Publication number 20020145193
- Publication date Oct 10, 2002
- International Business Machines Corporation
- Frederic Beaulieu
- H01 - BASIC ELECTRIC ELEMENTS

Sylvain Ouimet

Person

Patents Grantslast 30 patents

Antenna packaging solution

Antenna packaging solution

Flip chip assembly with connected component

Flip chip assembly with connected component

All intermetallic compound with stand off feature and method to make

Flip chip assembly with connected component

Laminate peripheral clamping to control microelectronic module BSM...

Silicon carrier optoelectronic packaging

Achieving mechanical and thermal stability in a multi-chip package

Silicon carrier optoelectronic packaging

Achieving mechanical and thermal stability in a multi-chip package

Method of removing metallic, inorganic and organic contaminants fro...

Structure and method for stress reduction in flip chip microelectro...

Method to reduce number of wire-bond loop heights versus the total...

Method to reduce number of wire-bond loop heights versus the total...

Wirebond passivation pad connection using heated capillary

Method to reduce number of wire-bond loop heights versus the total...

Leadframe and leadframe assembly for parallel optical computer link

Low-cost packaging for parallel optical computer link

Patents Applicationslast 30 patents

ANTENNA PACKAGING SOLUTION

ANTENNA PACKAGING SOLUTION

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

FLIP CHIP ASSEMBLY WITH CONNECTED COMPONENT

LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM...

SILICON CARRIER OPTOELECTRONIC PACKAGING

SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...

SILICON CARRIER OPTOELECTRONIC PACKAGING

Method of Removing Metallic, Inorganic and Organic Contaminants Fro...

System and Method of Achieving Mechanical and Thermal Stability in...

STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...

Method of Removing Metallic, Inorganic and Organic Contaminants fro...

Method to reduce number of wire-bond loop heights versus the total...

Method to reduce number of wire-bond loop heights versus the total...